DSP56303 datasheet(22/108 Pages) FREESCALE

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DSP56303 Technical Data, Rev. 11

2-2

Freescale Semiconductor

Specifications

2.3 Thermal Characteristics

2.4 DC Electrical Characteristics

Table 2-2.

Thermal Characteristics

Characteristic

Symbol

TQFP Value

MAP-BGA3

Value

MAP-BGA4

Value

Unit

Junction-to-ambient thermal resistance1

RθJA or θJA

°C/W

Junction-to-case thermal resistance2

RθJC or θJC

—

°C/W

Thermal characterization parameter

ΨJT

—

°C/W

Notes:

Junction-to-ambient thermal resistance is based on measurements on a horizontal single-sided printed circuit board per

JEDEC Specification JESD51-3.

Junction-to-case thermal resistance is based on measurements using a cold plate per SEMI G30-88, with the exception that

the cold plate temperature is used for the case temperature.

These are simulated values. See note 1 for test board conditions.

These are simulated values. The test board has two 2-ounce signal layers and two 1-ounce solid ground planes internal to the

test board.

Table 2-3.

DC Electrical Characteristics6

Characteristics

Symbol

Min

Typ

Max

Unit

Supply voltage

VCC

3.0

3.3

3.6

Input high voltage

•

D[0–23], BG, BB, TA

•MOD1/IRQ1, RESET, PINIT/NMI and all

JTAG/ESSI/SCI/Timer/HI08 pins

•EXTAL

VIH

VIHP

VIHX

2.0

0.8

× VCC

—

VCC

5.25

VCC

Input low voltage

•

D[0–23], BG, BB, TA, MOD

1/IRQ1, RESET, PINIT

•

All JTAG/ESSI/SCI/Timer/HI08 pins

•EXTAL8

VIL

VILP

VILX

–0.3

—

0.8

0.2

× VCC

Input leakage current

IIN

–10

—

µA

High impedance (off-state) input current (@ 2.4 V / 0.4 V)

ITSI

–10

—

µA

Output high voltage

•TTL (IOH = –0.4 mA)

5,7

•CMOS (IOH = –10 µA)

VOH

2.4

VCC – 0.01

—

Output low voltage

•TTL (IOL = 1.6 mA, open-drain pins IOL = 6.7 mA)

5,7

•CMOS (IOL = 10 µA)

VOL

—

0.4

0.01

Internal supply current2:

•

In Normal mode

•In Wait mode

•

In Stop mode4

ICCI

ICCW

ICCS

—

127

7.5

100

—

µA

PLL supply current

—1

2.5

Input capacitance5

CIN

—

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