L2500 datasheet(46/91 Pages) INTEL

46 / 91 page

Package Mechanical Specifications and Pin Information

Datasheet

4.1.2

Processor Component Keep-Out Zones

The processor may contain components on the substrate that define component keep-

out zone requirements. A thermal and mechanical solution design must not intrude into

the required keep-out zones. Decoupling capacitors are typically mounted in the keep-

out areas. The location and quantity of the capacitors may change, but will remain

within the component keep-in. See Figure 7 and Figure 9 for keep-out zones.

4.1.3

Package Loading Specifications

Maximum mechanical package loading specifications are given in Figure 7 and Figure 9.

These specifications are static compressive loading in the direction normal to the

processor. This maximum load limit should not be exceeded during shipping conditions,

standard use condition, or by thermal solution. In addition, there are additional load

limitations against transient bend, shock, and tensile loading. These limitations are

more platform specific, and should be obtained by contacting your field support.

Moreover, the processor package substrate should not be used as a mechanical

reference or load-bearing surface for thermal and mechanical solution.

4.1.4

Processor Mass Specifications

The typical mass of the processor is given in Figure 7 and Figure 9. This mass includes

all the components that are included in the package.

L2500 Datasheet(PDF) 46 Page - Intel Corporation