33874 datasheet(35/38 Pages) FREESCALE

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Analog Integrated Circuit Device Data

Freescale Semiconductor

33874

ADDITIONAL DOCUMENTATION

THERMAL ADDENDUM (REV 2.0)

Figure 11. Thermal Test Board

Device on Thermal Test Board

RθJA is the thermal resistance between die junction and

ambient air.

This device is a dual die package. Index m indicates the

die that is heated. Index n refers to the number of the die

where the junction temperature is sensed.

A =

300sqmm

76.2 mm

A =

300sqmm

A =

300sqmm

76.2 mm

A =

300sqmm

MC33874 Pin Connections

24-Pin PQFN (12 x 12)

0.9 mm Pitch

12.0 mm x 12.0 mm Body

Transparent Top View

10 9

GND

HS3

HS1

HS0

HS2

GND

FSI

GND

VPWR

Material:

Single layer printed circuit board

FR4, 1.6mm thickness

Cu traces, 0.07mm thickness

Outline:

80mm x 100mm board area,

including edge connector for thermal

testing

Area A:

Cu heat-spreading areas on board

surface

Ambient Conditions:

Natural convection, still air

Table 19. Thermal Resistance Performance

Thermal

Resistance

Area A

(mm2)

1 = Power Chip, 2 = Logic Chip (

°C/W)

m = 1,

n = 1

m = 1, n = 2

m = 2, n = 1

m = 2,

n = 2

RθJAmn

053

300

600

33874 Datasheet(PDF) 35 Page - Freescale Semiconductor, Inc

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