MAX4802ACCM datasheet(2/15 Pages) MAXIM

2 / 15 page

Low-Charge-Injection, 8-Channel, High-Voltage

Analog Switches with 20MHz Serial Interface

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ABSOLUTE MAXIMUM RATINGS

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

(All voltages referenced to GND.)

VDD Logic Supply Voltage........................................-0.3V to +7V

VPP - VNN Supply Voltage ....................................................220V

VPP Positive Supply Voltage......................-0.3V to (VNN + 220V)

VNN Negative Supply Voltage ..............................+0.3V to -220V

Logic Inputs LE, CLR, CLK, DIN ..............................-0.3V to +7V

DOUT..........................................................-0.3V to (VDD + 0.3V)

RGND (MAX4802A)...............................................-4.5V to +0.3V

COM_, NO_.................................................................VNN to VPP

Continuous Power Dissipation (TA = +70°C)

26-Bump CSBGA (derate 11.8mW/°C above +70°C)..941mW

28-Pin PLCC (derate 10.5mW/°C above +70°C) .........842mW

48-Pin LQFP (derate 22.7mW/°C above +70°C)........1818mW

Operating Temperature Range...............................0°C to +70°C

Storage Temperature Range .............................-65°C to +150°C

Junction Temperature ......................................................+150°C

Lead Temperature (excluding CSBGA, soldering, 10s) ..+300°C

Soldering Temperature (reflow)

28 PLCC.......................................................................+245°C

All other packages .......................................................+260°C

PACKAGE THERMAL CHARACTERISTICS (Note 1)

26 CSBGA

Junction-to-Ambient Thermal Resistance (

θJA)...........85°C/W

Junction-to-Case Thermal Resistance (

θJC)................23°C/W

28 PLCC

Junction-to-Ambient Thermal Resistance (

θJA)...........44°C/W

Junction-to-Case Thermal Resistance (

θJC)................10°C/W

48 LQFP

Junction-to-Ambient Thermal Resistance (

θJA)...........44°C/W

Junction-to-Case Thermal Resistance (

θJC)................10°C/W

ELECTRICAL CHARACTERISTICS

(VDD = +2.7V to +6V, VPP = +40V to (VNN + 200V), VNN = -40V to -160V, TA = TMIN to TMAX, unless otherwise noted. Typical values

are at TA = +25°C.) (Note 2)

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

ANALOG SWITCH

Analog-Signal Range

VCOM_,

VNO_

(Note 3)

VNN +

VPP -

TA = 0°C

TA = +25°C

ICOM = 5mA

TA = +70°C

TA = 0°C

TA = +25°C

VPP = +40V,

VNN = -160V,

VCOM_ = 0V

ICOM =

200mA

TA = +70°C

TA = 0°C

TA = +25°C

ICOM = 5mA

TA = +70°C

TA = 0°C

TA = +25°C

Small-Signal Switch

On-Resistance

RONS

VPP = +100V,

VNN = -100V,

VCOM_ = 0V

ICOM =

200mA

TA = +70°C

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

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