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HT1382 Datasheet(PDF) 28 Page - Holtek Semiconductor Inc |
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HT1382 Datasheet(HTML) 28 Page - Holtek Semiconductor Inc |
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28 / 29 page  TSSOP 8L Symbol Description Dimensions in mm W Carrier Tape Width 12.0 +0.3/-0.1 P Cavity Pitch 8.0 ±0.1 E Perforation Position 1.75 ±0.10 F Cavity to Perforation (Width Direction) 5.5 ±0.5 D Perforation Diameter 1.5 +0.1/-0.0 D1 Cavity Hole Diameter 1.5 +0.1/-0.0 P0 Perforation Pitch 4.0 ±0.1 P1 Cavity to Perforation (Length Direction) 2.0 ±0.1 A0 Cavity Length 7.0 ±0.1 B0 Cavity Width 3.6 ±0.1 K0 Cavity Depth 1.6 ±0.1 t Carrier Tape Thickness 0.300 ±0.013 C Cover Tape Width 9.3 ±0.1 Rev. 1.40 28 May 27, 2011 HT1382 I2C/3-Wire Real Time Clock |
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