MAX11329 datasheet(2/37 Pages) MAXIM

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MAX11329–MAX11332

3Msps, 12-/10-Bit, 8-/16-Channel ADCs with

Post-Mux External Signal Conditioning Access

VDD to GND.............................................................-0.3V to +4V

OVDD, AIN0–AIN13, CNVST/AIN14, REF+, REF-/AIN15

to GND......................-0.3V to the lower of (VDD + 0.3V) and +4V

CS, SCLK, DIN, DOUT, EOC TO GND .......-0.3V to the lower of

(VOVDD + 0.3V) and +4V

DGND to GND......................................................-0.3V to +0.3V

Input/Output Current (all pins) ...........................................50mA

Continuous Power Dissipation (TA = +70NC)

TQFN (derate 34.4mW/NC above +70NC)..................2758mW

Operating Temperature Range........................ -40NC to +125NC

Junction Temperature .....................................................+150NC

Storage Temperature Range............................ -65NC to +150NC

Lead Temperature (soldering, 10s) ................................+300NC

Soldering Temperature (reflow) ......................................+260NC

TQFN

Junction-to-Ambient Thermal Resistance (BJA)...........29NC/W

Junction-to-Case Thermal Resistance (BJC)..................2NC/W

ABSOLUTE MAXIMUM RATINGS

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-

tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

PACKAGE THERMAL CHARACTERISTICS (Note 1)

ELECTRICAL CHARACTERISTICS (MAX11331/MAX11332)

(VDD = 2.35V to 3.6V, VOVDD = 1.5V to 3.6V, fSAMPLE = 3Msps, fSCLK = 48MHz, 50% duty cycle, VREF+ = VDD, TA = -40NC to +125NC,

unless otherwise noted. Typical values are at TA = +25NC.) (Note 2)

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

DC ACCURACY (Notes 3 and 4)

Resolution

RES

12 bit

Bits

Integral Nonlinearity

INL

1.0

LSB

Differential Nonlinearity

DNL

No missing codes

1.0

LSB

Offset Error

1.2

3.0

LSB

Gain Error

(Note 5)

5.5

LSB

Offset Error Temperature Coefficient

OETC

ppm/NC

Gain Temperature Coefficient

GETC

0.8

ppm/NC

Channel-to-Channel Offset Matching

0.5

LSB

Line Rejection

PSR

(Note 6)

0.3

LSB/V

DYNAMIC PERFORMANCE (100kHz, input sine wave) (Notes 3 and 7)

Signal-to-Noise Plus Distortion

SINAD

71.9

Signal-to-Noise Ratio

SNR

72.3

Total Harmonic Distortion

(Up to the 5th Harmonic)

THD

-88

-76

Spurious-Free Dynamic Range

SFDR

Intermodulation Distortion

IMD

f1 = 99.2432kHz, f2 = 69.2139kHz

-85

Full-Power Bandwidth

-3dB

MHz

-0.1dB

Full-Linear Bandwidth

SINAD ≥ 70dB

0.5

MHz

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