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ADV7129 Datasheet(PDF) 15 Page - Analog Devices |
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ADV7129 Datasheet(HTML) 15 Page - Analog Devices |
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15 / 20 page ![]() ADV7129 –15– REV. 0 APPENDIX I BOARD DESIGN AND LAYOUT CONSIDERATIONS The ADV7129 is a highly integrated circuit containing both precision analog and high speed digital circuitry. It has been designed to minimize interference effects on the integrity of the analog circuitry by the high speed digital circuitry. It is impera- tive that these same design and layout techniques be applied to the system level design such that high speed, accurate perfor- mance is achieved. The “Recommended Analog Circuit Layout” (see Figure 12) shows the analog interface between the device and monitor. The layout should be optimized for lowest noise on the ADV7129 power and ground lines by shielding the digital inputs and pro- viding good decoupling. The lead length between groups of VAA and GND pins should by minimized so as to minimize inductive ringing. Ground Planes The ground plane should encompass all ADV7129 ground pins, voltage reference circuitry, power supply bypass circuitry for the ADV7129, the analog output traces, and all the digital signal traces leading up to the ADV7129. The analog ground plane should be separated from the system ground plane by a ferrite bead. Power Planes The ADV7129 and any associated analog circuitry should have its own power plane, referred to as the analog power plane (VAA). This power plane should be connected to the regular PCB power plane (VCC) at a single point through a ferrite bead. This bead should be located within three inches of the ADV7129. The PCB power plane should provide power to all digital logic on the PC board, and the analog power plane should provide power to all ADV7129 power pins and voltage reference circuitry. Plane-to-plane noise coupling can be reduced by ensuring that portions of the regular PCB power and ground planes do not overlay portions of the analog power plane, unless they can be arranged such that the plane-to-plane noise is common mode. Supply Decoupling For optimum performance, bypass capacitors should be installed using the shortest leads possible, consistent with reliable opera- tion, to reduce the lead inductance. Best performance is obtained with 0.1 µF ceramic capacitor decoupling. Each group of V AA pins on the ADV7129 must have at least one 0.1 µF decoupling capacitor to GND. These capacitors should be placed as close as possible to the device. It is important to note that while the ADV7129 contains cir- cuitry to reject power supply noise, this rejection decreases with frequency. If a high frequency switching power supply is used, the designer should pay close attention to reducing power supply noise and consider using a three terminal voltage regulator for supplying power to the analog power plane. Digital Signal Interconnect The digital inputs to the ADV7129 should be isolated as much as possible from the analog outputs and other analog circuitry. Also, these input signals should not overlay the analog power plane. Due to the high clock rates involved, long clock lines to the ADV7129 should be avoided to reduce noise pickup. Any active termination resistors for the digital inputs should be connected to the regular PCB power plane (VCC), and not the analog power plane. Analog Signal Interconnect The ADV7129 should be located as close as possible to the output connectors to minimize noise pickup and reflections due to impedance mismatch. The video output signals should overlay the ground plane, and not the analog power plane, to maximize the high fre- quency power supply rejection. Digital Inputs, especially Pixel Data Inputs and clocking signals (LOADOUT, LOADIN, etc.) should never overlay any of the analog signal circuitry and should be kept as far away as possible. For best performance, the analog outputs should each have a 50 Ω load resistor connected to GND. These resistors should be placed as close as possible to the ADV7129 so as to minimize reflections. There are a number of precautions that the user can take to minimize the effects of data feedthrough. a. Apply external filtering to the DAC outputs. b. Reduce input voltage risetime. From experiments, it has been seen that a reduction from 2 ns to 4 ns gives signifi- cant improvement. c. Reduce input voltage swing. A reduction from 5 V to 3 V gives significant improvement. d. Use series resistors on the pixel inputs (e.g., 100 Ω). e. The part can be run at 2 × DAC current levels as shown in the DAC output. The differential outputs can then be connected through a differential to single balun trans- former to eliminate common-mode noise. A phase split- ter should be used to reduce the 2 × levels to 1× at the monitor end. |
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