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ADV7129

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APPENDIX II

THERMAL AND ENVIRONMENTAL CONSIDERATIONS

The ADV7129 is a very highly integrated monolithic silicon

device. This high level of integration inevitably leads to consid-

eration of thermal and environmental conditions which the

ADV7129 must operate in. Reliability of the device is enhanced

by keeping it as cool as possible. In order to avoid destructive

damage to the device, the absolute maximum junction tempera-

ture must never be exceeded. Certain applications, depending

on ambient temperature and pixel data rates may require forced

air cooling or external heatsinks. The following data is intended as

a guide in evaluating the operating conditions of a particular appli-

cation so that optimum device and system performance is achieved.

It should be noted that information on package characteristics

published herein may not be the most up to date at the time of

reading this. Advances in package compounds and manufacture

will inevitably lead to improvements in the thermal data. Please

contact your local sales office for the most up-to-date information.

Package Characteristics

Junction-to-Case (

JC) Thermal Resistance for this particular

part is:

JC = 8.9°C/W

(Note:

JC is independent of airflow.)

The maximum silicon junction temperature should be limited to

100

°C. Temperatures greater than this will reduce long-term

device reliability. To ensure that the silicon junction tempera-

ture stays within prescribed limits, the addition of an external

heatsink can be used if the junction temperature is brought be-

yond the maximum limit.

Junction-to-Ambient (

JA) Thermal Resistance for this particu-

lar part is:

JA = 25.9

°C/W (Still Air)

JA = will significantly decrease in air flow.

Thermal Model

The junction temperature of the device in a specific application

is given by:

TJ = TA + PD (

JC +

CA)

(1)

TJ = TA + PD (

JA)

(2)

where:

TJ = Junction Temperature of Silicon (

°C)

TA = Ambient Temperature (°C)

PD = Power Dissipation (W)

JC =

Junction to Case Thermal Resistance (

°C/W)

CA =

Case to Ambient Thermal Resistance (

°C/W)

JA =

Junction to Ambient Thermal Resistance (

°C/W)

SPEED – MHz

160

200

240

280

320

360

550

500

475

450

425

525

VAA = +5V

Figure 13. Supply Current vs. Frequency

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