AD9776-EB datasheet(8/56 Pages) AD

8 / 56 page

AD9776/AD9778/AD9779

Rev. A | Page 8 of 56

ABSOLUTE MAXIMUM RATINGS

Table 5.

Parameter

With

Respect

Rating

AVDD33, DVDD33

AGND,

DGND,

CGND

−0.3 V to +3.6 V

DVDD18, CVDD18

AGND,

DGND,

CGND

−0.3 V to +1.98 V

AGND

DGND,

CGND

−0.3 V to +0.3 V

DGND

AGND,

CGND

−0.3 V to +0.3 V

CGND

AGND,

DGND

−0.3 V to +0.3 V

I120, VREF, IPTAT

AGND

−0.3 V to AVDD33 + 0.3 V

IOUT1-P, IOUT1-N, IOUT2-P,

IOUT2-N, Aux1-P, Aux1-N,

Aux2-P, Aux2-N

AGND

−1.0 V to AVDD33 + 0.3 V

P1D15 to P1D0,

P2D15 to P2D0

DGND

−0.3 V to DVDD33 + 0.3 V

DATACLK, TXENABLE

DGND

−0.3 V to DVDD33 + 0.3 V

CLK+, CLK−

CGND

−0.3 V to CVDD18 + 0.3 V

RESET, IRQ, PLL_LOCK,

SYNC_O+, SYNC_O−,

SYNC_I+, SYNC_I−,

CSB, SCLK, SDIO, SDO

DGND

−0.3 V to DVDD33 + 0.3 V

Junction Temperature

+125°C

Storage Temperature

Range

−65°C to +150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

100-lead, thermally enhanced TQFP_EP package, θJA = 19.1°C/W

with the bottom EPAD soldered to the PCB. With the bottom

EPAD not soldered to the PCB, θJA = 27.4°C/W. These

specifications are valid with no airflow movement.

ESD CAUTION

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