C4532 datasheet(69/72 Pages) TDK

69 / 72 page

TDK MLCC US Catalog

Version B11

Page 71

Appendix - 1a

P.C. Board for reliability test

Applied for C0603, C1005, C1608, C2012, C3216

Appendix - 1b

P.C. Board for reliability test

Applied for C3225, C4532, C5750

Appendix - 2a

P.C. Board for bending test

Applied for C0603, C1005

Appendix - 2b

P.C. Board for bending test

Applied for C1608, C2012, C3216, C3225, C4532, C5750

100 mm

Solder Resist

Copper

Solder Resist

Slit

100 mm

Solder Resist

Copper

100 mm

Solder resist

100 mm

Copper

Material: Glass Epoxy (As per JIS C6484 GE4)

P.C. Board thickness: Appendix-2a

0.8mm

Appendix-1a, 1b, 2b

1.6mm

Copper (thickness 0.035mm)

Solder resist

Case Code

Dimensions (mm)

JIS

EIA

C0603

CC0201

0.3

0.8

0.3

C1005

CC0402

0.4

1.5

0.5

C1608

CC0603

1.0

3.0

1.2

C2012

CC0805

1.2

4.0

1.65

C3216

CC1206

2.2

5.0

2.0

C3225

CC1210

2.2

5.0

2.9

C4532

CC1812

3.5

7.0

3.7

C5750

CC2220

4.5

8.0

5.6

General

Specifications

C Series – General Application

C4532 Datasheet(PDF) 69 Page - TDK Electronics

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