TPS61301 datasheet(2/77 Pages) TI

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TPS61300

TPS61301

TPS61305, TPS61305A

SLVS957D – JUNE 2009 – REVISED OCTOBER 2012

www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

AVAILABLE OPTIONS

PART NUMBER(1)

PACKAGE MARKING

PACKAGE

DEVICE SPECIFIC FEATURES(2)

TPS61300YFF

TPS61300

CSP-20

Hardware Enable DC Light Input (ENDCL)

TPS61301YFF

TPS61301

CSP-20

Hardware Enable / Disable Input (NRESET)

TPS61305YFF

TPS61305

CSP-20

LED Temperature Monitoring Input (TS)

Hardware Enable / Disable Input (NRESET)

TPS61305AYFF

TPS61305A

CSP-20

LED Temperature Monitoring Input (TS)

Hardware Enable DC Light Input (ENDCL)

TPS61306YFF(3)

TPS61306

CSP-20

LED Temperature Monitoring Input (TS)

(1)

The YFF package is available in tape and reel. Add R suffix (TPS6130xYFFR) to order quantities of 3000 parts per reel, T suffix for 250

parts per reel.

(2)

For more details, refer to the section Application Diagrams.

(3)

Device status is Product Preview. Please contact TI for more details.

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range (unless otherwise noted)

(1)

VALUE

UNIT

Voltage range on AVIN, VOUT, SW, LED1, LED2, LED3(2)

–0.3 to 7

Voltage range on SCL, SDA, FLASH_SYNC, ENDCL, NRESET, ENVM, GPIO/PG(2)

–0.3 to 7

Voltage range on HC_SEL, Tx-MASK, TS, BAL (2)

–0.3 to 7

Current on GPIO/PG

±25

Power dissipation

Internally limited

(3)

Operating ambient temperature range

–40 to 85

°C

TJ (MAX)

Maximum operating junction temperature

150

°C

Tstg

Storage temperature range

–65 to 150

°C

Human body model

ESD rating (4)

Charge device model

500

Machine model

100

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to network ground terminal.

(3)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature [TA(max)] is dependent on the maximum operating junction temperature [TJ(max)], the

maximum power dissipation of the device in the application [PD(max)], and the junction-to-ambient thermal resistance of the part/package

in the application (

θJA), as given by the following equation: TA(max) = TJ(max) – (θJA × PD(max))

(4)

The human body model is a 100-pF capacitor discharged through a 1.5-k

Ω resistor into each pin. The machine model is a 200-pF

capacitor discharged directly into each pin.

DISSIPATION RATINGS

PACKAGE

THERMAL RESISTANCE(1)

POWER RATING

DERATING FACTOR

θJA

θJB

TA = 25°C

ABOVE(2) TA = 25°C

YFF

71°C/W

21°C/W

1.4 W

14mW/°C

(1)

Simulated with high-K board

(2)

Maximum power dissipation is a function of TJ(max), θJA and TA. The maximum allowable power dissipation at any allowable ambient

temperature is PD = (TJ(max) – TA)/ θJA.

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Product Folder Links: TPS61300 TPS61301 TPS61305 TPS61305A

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