ii

CONTENTS

PAGE

1.1 Key Performance Features ................................................................................................................. 2

1.1.1 Memory Space And Addressing Modes ................................................................................... 4

1.1.2 Data Types ............................................................................................................................... 4

1.1.3 Large Register Set ................................................................................................................... 4

1.1.4 Multiple Register Sets .............................................................................................................. 5

1.1.5 Instruction Cache ..................................................................................................................... 5

1.1.6 Register Scoreboarding ........................................................................................................... 5

1.1.7 Floating-Point Arithmetic .......................................................................................................... 6

1.1.8 High Bandwidth Bus ................................................................................................................ 6

1.1.9 Interrupt Handling .................................................................................................................... 7

1.1.10 Debug Features ..................................................................................................................... 7

1.1.11 Fault Detection ....................................................................................................................... 7

1.1.12 Built-in Testability ................................................................................................................... 7

1.1.13 CHMOS .................................................................................................................................. 7

2.0 ELECTRICAL SPECIFICATIONS............................................................................................................. 11

2.1 Power and Grounding ....................................................................................................................... 11

2.2 Power Decoupling Recommendations .............................................................................................. 11

2.3 Connection Recommendations ......................................................................................................... 11

2.4 Characteristic Curves ....................................................................................................................... 11

2.5 Test Load Circuit ............................................................................................................................... 13

2.6 ABSOLUTE MAXIMUM RATINGS* .................................................................................................. 14

2.7 DC Characteristics ............................................................................................................................ 14

2.8 AC Specifications .............................................................................................................................. 15

3.0 MECHANICAL DATA ............................................................................................................................... 20

3.1 Packaging ......................................................................................................................................... 20

3.2 Pin Assignment ................................................................................................................................. 20

3.3 Pinout ................................................................................................................................................ 22

3.4 Package Thermal Specifications ...................................................................................................... 26

4.0 WAVEFORMS ........................................................................................................................................... 27

5.0 REVISION HISTORY ................................................................................................................................ 33

80960SB

EMBEDDED 32-BIT MICROPROCESSOR

WITH 16-BIT BURST DATA BUS