80960SB datasheet(38/38 Pages) INTEL

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80960SB

The sections significantly changed between revisions -003 and -004 of the 80960SA/SB Data Sheet were:

Section

Last

Rev.

Description

DC Characteristics

-003

Operating temperature for PLCC package changed:

WAS:

TCASE = 0°C to +100°C

IS:

TCASE = 0°C to +85°C

The test program has not changed.

Table 7. QFP Package, Thermal Resis-

tance —

°C/Watt

-003

Corrected QFP Package Thermal Resistance values:

for

JA at 0 ft./min.

for

JC at 0 ft./min.

airflow:

WAS:

45.7

° /W

WAS:

° /W

IS:

° /W

IS:

° /W

Table 8. PLCC Package, Thermal Resis-

tance —

°C/Watt

-003

Corrected PLCC Package Thermal Resistance val-

ues:

for

JA:

at 50 ft./min. airflow

at 100 ft./min. airflow

WAS:

IS:

28.5

for

JC:

at 0 ft./min. airflow

at 50–1000 ft./min. airflow

WAS:

IS:

Table 9. 80960SA and 80960SB QFP

Pinout — In Pin Order

-003

Signal A12 incorrectly shown as Pin 28; is now cor-

rectly shown as Pin 38. Note added to clarify No Con-

nect Pins.

80960SB Datasheet(PDF) 38 Page - Intel Corporation

80960SB Datasheet(HTML) 38 Page - Intel Corporation

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