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AN3981 Datasheet(PDF) 52 Page - STMicroelectronics |
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AN3981 Datasheet(HTML) 52 Page - STMicroelectronics |
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52 / 54 page  PCB layout guidelines AN3981 52/54 Doc ID 022217 Rev 1 Figure 63. Digital signal quality Other recommendations involve the position of the devices on the application board compared to the LED arrangements. Some precautions should be considered (avoiding too long wires or traces, tortuous paths, careful clock distribution, etc.), although there are often also restrictions due to the application itself (e.g. shape of the board, particular LED arrangement, etc.). Finally, for correct power dissipation and to prevent overheating of the device, it is very important to properly solder the exposed pad of the package (if present in the selected package) to the dedicated copper pad, following the indications (in terms of size) provided for that kind of package. AM10663v1 poor signal good signal CLK, LE, etc. CLK, LE, etc. Proper filtering to improve digital signals quality |
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