AN3981 datasheet(40/54 Pages) STMICROELECTRONICS

40 / 54 page

Common application information

AN3981

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Doc ID 022217 Rev 1

Figure 47.

Maximum power curves for different packages

Figure 48

and 49 show the significant difference in terms of power dissipation and,

consequently, also of heat generation.

The images have been captured by an infrared (IR) camera.

Two different packages are compared: TSSOP-24 (left) and HTSSOP-24 (right). Although

the temperature detected by the IR camera refers to the package surface temperature, it

provides, however, an idea regarding the trend of the junction temperature and provides a

comparison of the two packages in terms of thermal behavior.

Both images show the STP16CPC26 under the same conditions: all channels on, 60 mA per

channel, 1.2 V voltage drop across current generators and 5 V IC voltage supply. The PCB

used in both cases is the same.

As described above, in this case the power dissipation is 1.152 W.

The advantage of the exposed pad in HTSSOP-24 compared to TSSOP-24 is evident.

AM10647v1

DISS

AN3981 Datasheet(PDF) 40 Page - STMicroelectronics