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AN3981 Datasheet(PDF) 37 Page - STMicroelectronics |
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AN3981 Datasheet(HTML) 37 Page - STMicroelectronics |
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37 / 54 page  AN3981 Common application information Doc ID 022217 Rev 1 37/54 The value of the thermal resistance junction-to-ambient ( θ ja) indicated in Table 5 refers to a standard PCB, in accordance with JEDEC guidelines. It is worth remembering that the θ ja is strongly influenced by the PCB and the actual values can be different to those listed in the table. However, assuming correct the θ ja in Table 5, the maximum power dissipation allowed, according to the ambient temperature, is shown in Figure 43, Figure 44, Figure 45 and Figure 46. Figure 43. Maximum power dissipation vs. ambient temperature for different packages for 4-bit LED drivers 8 TSSOP-16 140 8 HTSSOP-16 (exposed pad) 37.5 16 SO-24 42.7 16 TSSOP-24 55 16 QSOP-24 55 16 HTSSOP-24 (exposed pad) 37.5 24 TQFP-48 33 Table 5. Thermal resistance junction to case for different packages (continued) #channels Package θ ja (°C/W) |
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