GND PLANE

Represents via used for

application specific connections

1

2

3

4

TLV707, TLV707P

www.ti.com

SBVS153D – FEBRUARY 2011 – REVISED JANUARY 2015

10 Power Supply Recommendations

The device is designed to operate from an input voltage supply range between 2.0 V and 5.5 V. The input

voltage range provides adequate headroom in order for the device to have a regulated output. This input supply

must be well regulated (see Figure 46 through Figure 53). If the input supply is noisy, additional input capacitors

with low ESR help improve the output noise performance.

11 Layout

11.1 Layout Guidelines

11.1.1 Board Layout Recommendations to Improve PSRR and Noise Performance

Place input and output capacitors as close to the device pins as possible. To improve ac performance (such as

PSRR, output noise, and transient response), TI recommends that the board be designed with separate ground

ground connection for the output capacitor directly to the GND pin of the device. High ESR capacitors may

degrade PSRR performance.

11.1.2 Package Mounting

Solder pad footprint recommendations are available from TI's website at www.ti.com. The recommended land

pattern for the DQN (X2SON-4) package is shown in Mechanical, Packaging, and Orderable Information.

11.2 Layout Example

Figure 68. Recommended Layout Example

11.3 Thermal Considerations

Thermal protection disables the output when the junction temperature rises to approximately 160°C, allowing the

device to cool. When the junction temperature cools to approximately 140°C, the output circuitry is again

enabled. Depending on power dissipation, thermal resistance, and ambient temperature, the thermal protection

circuit may cycle on and off. This cycling limits the dissipation of the regulator, thus protecting the regulator from

damage as a result of overheating.

Any tendency to activate the thermal protection circuit indicates excessive power dissipation or an inadequate

heatsink. For reliable operation, limit junction temperature to 125°C (maximum). To estimate the margin of safety

in a complete design (including heatsink), increase the ambient temperature until the thermal protection is

triggered; use worst-case loads and signal conditions.

For good reliability, thermal protection triggers at least 35°C above the maximum expected ambient condition of

the particular application. This configuration produces a worst-case junction temperature of 125°C at the highest

expected ambient temperature and worst-case load.

The internal protection circuitry of the LDO is designed to protect against overload conditions. This circuitry is not

intended to replace proper heatsinking. Continuously running the LDO into thermal shutdown degrades device

reliability.

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