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TLV707P Datasheet(PDF) 25 Page - Texas Instruments |
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TLV707P Datasheet(HTML) 25 Page - Texas Instruments |
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25 / 42 page ![]() TLV707, TLV707P www.ti.com SBVS153D – FEBRUARY 2011 – REVISED JANUARY 2015 12 Device and Documentation Support 12.1 Device Support 12.1.1 Development Support 12.1.1.1 Evaluation Modules An evaluation module (EVM) is available to assist in the initial circuit performance evaluation using the TLV707xx and TLV707xxP. SLVU416 details the design kits and evaluation modules for TLV70728EVM-612. The EVM can be requested at the Texas Instruments web site through the TLV707xx and TLV707xxP product folders, or purchased directly from the TI eStore. 12.1.1.2 Spice Models Computer simulation of circuit performance using SPICE is often useful when analyzing the performance of analog circuits and systems. A SPICE model for the TLV707xx and TLV707xxP is available through the respective device product folders under Simulation Models. 12.1.2 Device Nomenclature Table 2. Ordering Information(1) PRODUCT VOUT (2) TLV707xx(x)Pyyyz XX(X) is the nominal output voltage. For output voltages with a resolution of 100 mV, two digits are used in the ordering number; otherwise, three digits are used (for example, 18 = 1.8 V, 285 = 2.85 V). P is optional; devices with P have an LDO regulator with an active output discharge. YYY is the package designator. Z is package quantity. Use R for reel (3000 pieces), and T for tape (250 pieces). (1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or visit the device product folder at www.ti.com. (2) Output voltages from 0.85 V to 5.0 V in 50-mV increments are available. Contact factory for details and availability. 12.2 Documentation Support 12.2.1 Related Documentation For related documentation see the following: • TLV70728EVM-612 Evaluation Module, SLVU416 12.3 Trademarks All trademarks are the property of their respective owners. 12.4 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 12.5 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated family of devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback 25 |
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