TLV707P datasheet(24/42 Pages) TI

Part #	TLV707P

Description	TLV707xx, TLV707xxP 200-mA, Low-IQ, Low-Noise, Low-Dropout Regulator for Portable Devices

PDF	42 Pages

Scroll/Zoom	100%

Manufacturer	TI [Texas Instruments]

Direct Link	http://www.ti.com

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24 / 42 page

P =(V

)

OUT

TLV707, TLV707P

SBVS153D – FEBRUARY 2011 – REVISED JANUARY 2015

www.ti.com

11.4 Power Dissipation

The ability to remove heat from the die is different for each package type, presenting different considerations in

the printed-circuit-board (PCB) layout. The PCB area around the device that is free of other components moves

the heat from the device to the ambient air.

Performance data for JEDEC low- and high-K boards are given in Thermal Information. Using heavier copper

increases the effectiveness in removing heat from the device. The addition of plated through-holes to heat-

dissipating layers also improves heatsink effectiveness.

Power dissipation depends on input voltage and load conditions. Power dissipation (PD) is equal to the product of

the output current and the voltage drop across the output pass element, as shown in Mechanical, Packaging,

and Orderable Information.

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TLV707P Datasheet(PDF) 24 Page - Texas Instruments