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TMP107 Datasheet(PDF) 32 Page - Texas Instruments |
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TMP107 Datasheet(HTML) 32 Page - Texas Instruments |
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32 / 40 page ![]() Supply Bypass Capacitor V+ R1 ALERT2 I/O2 R2 ALERT1 GND I/O1 GND I/O2 GND I/O1 V+ PCB border Capacitor V+ TMP107 SBOS716B – MAY 2015 – REVISED SEPTEMBER 2015 www.ti.com 9 Power Supply Recommendations The TMP107 device operates with a power supply in the range of 1.7 V to 5.5 V. The device is optimized for operation at a 3.3-V supply, but measures temperature accurately for the full supply range. For best performance, use a 0.1-µF power-supply bypass capacitor. Place the bypass capacitor as close as possible to the supply and ground pins of the device. Applications with noisy or high-impedance power supplies may require additional bypass capacitors to reject power-supply noise. 10 Layout 10.1 Layout Guidelines Mount the TMP107 to a PCB as shown in Figure 44. Obtaining acceptable performance with alternate layout schemes is possible, however this layout produces good results and is intended as a guideline. • Bypass the V+ pin to ground with a low-ESR ceramic bypass-capacitor. The typical recommended bypass capacitance is a 0.1- μF ceramic capacitor with a X5R or X7R dielectric. The optimum placement is closest to the V+ and GND pins of the device. Take care to minimize the loop area formed by the bypass-capacitor connection, the V+ pin, and the GND pin of the IC. • Use larger copper area pads to reduce self-heating and lower thermal resistance to the environment. • If possible, use PCB boards with thick copper layers. • If possible, do not use stain to protect the IC because stain can increase thermal resistance. 10.2 Layout Example Figure 44. Layout Example 32 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: TMP107 |
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