SN65DP149 datasheet(7/52 Pages) TI1

7 / 52 page

SN65DP149, SN75DP149

www.ti.com

SLLSEL2A – SEPTEMBER 2015 – REVISED DECEMBER 2015

7.4 Thermal Information

over operating free-air temperature range (unless otherwise noted)

SNx5DP149

THERMAL METRIC(1)

RSB (WQFN)

UNIT

40 PINS

RθJA

Junction-to-ambient thermal resistance

37.3

°C/W

RθJB

Junction-to-board thermal resistance (High-K board(2))

9.9

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance (High-K board(2))

23.1

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

3.2

°C/W

ψJT

Junction-to-top characterization parameter

0.3

°C/W

ψJB

Junction-to-case (bottom) thermal resistance

3.2

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

Test conditions for

ΨJB and ΨJT are clarified in TI document SPRA953, Semiconductor and IC Package Thermal Metrics.

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