ADM1260 datasheet(71/71 Pages) AD

71 / 71 page

Data Sheet

ADM1260

Rev. 0 | Page 71 of 71

OUTLINE DIMENSIONS

0.50

BSC

BOTTOM VIEW

TOP VIEW

PIN 1

INDICATOR

EXPOSED

PAD

PIN 1

INDICATOR

SEATING

PLANE

0.05 MAX

0.02 NOM

0.20 REF

COPLANARITY

0.08

0.30

0.25

0.18

6.10

6.00 SQ

5.90

0.80

0.75

0.70

FORPROPERCONNECTIONOF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.45

0.40

0.35

0.20 MIN

*4.70

4.60 SQ

4.50

COMPLIANT TO JEDEC STANDARDS MO-220-WJJD-5

WITH EXCEPTION TO EXPOSED PAD DIMENSION.

Figure 52. 40-Lead Lead Frame Chip Scale Package [LFCSP]

6 mm × 6 mm Body and 0.75 mm Package Height

(CP-40-7)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

ADM1260ACPZ

−40°C to +85°C

40-Lead Lead Frame Chip Scale Package [LFCSP]

CP-40-7

ADM1260ACPZ-RL7

−40°C to +85°C

40-Lead Lead Frame Chip Scale Package [LFCSP]

CP-40-7

EVAL-ADM1260EBZ

Evaluation Kit

1 Z = RoHS Compliant Part.

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D12445-0-4/16(0)

ADM1260 Datasheet(PDF) 71 Page - Analog Devices

ADM1260 Datasheet(HTML) 71 Page - Analog Devices

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