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DP83861 Datasheet(PDF) 17 Page - National Semiconductor (TI) |
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DP83861 Datasheet(HTML) 17 Page - National Semiconductor (TI) |
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17 / 88 page ![]() 17 www.national.com 3.0 Design and Layout Guide This guide will provide information to assist in the design and layout of the DP83861 Gigabit Ethernet Transceiver. This guide will cover the following areas: — Power Supply Filtering — Twisted Pair Interface — MAC Interface —Clocks — LED/Strapping Configuration — Unused Pins/ Reserved Pins — Hardware Reset — Temperature Considerations — List of Pins and Pin Connection Guide 3.1 Power Supply Filtering It is recommended that the PCB have at least one solid ground plane, one solid 3.3 V plane, and one solid 1.8 V plane, with no breaks in any of these planes. The inter- plane capacitance between the supply and ground planes should be maximized by minimizing the distance between these planes. Filling unused signal planes with copper and connecting them to the proper power plane will also increase the interplane capacitance. The inter-plane capacitance acts like a short at high frequencies to reduce supply plane impedance. Not all designs will be able to incorporate the recommended suggestions because of board cost constraints. Working designs have been done using only 4 layers. National has a reference design built using the EN Gig PHYTER and our GigMAC. This refer- ence design is a PCI NIC card, using only 4 layers and having component placement on only one side of the board to reduce cost. The schematic, layout and gerber files for this reference design are available upon request. The 3.3 V & the 1.8 V supply pins come in pairs with their corresponding ground pins (i.e. a 3.3 V supply-ground pair is formed by pin 2 [RA_AVDD] and pin 3 [RA_AGND]). These paired pins are physically adjacent to each other. The matching pins should be bypassed with low imped- ance surface mount capacitors of value 0.1 µF connected directly into the power planes with vias as close as possible to the pins. This will reduce the inductance in series with the bypass capacitor. Any increase in inductance will lower the capacitor’s self resonant frequency which will degrade the high frequency performance of the capacitor. It’s also recommended that 0.01 µF capacitors are connected in parallel with the 0.1 µF capacitors, or at least "dispersed", replacing some of the 0.1 µF capacitors. The lower value capacitance will increase the frequency range of effective- ness of the bypassing scheme. This is due to the unavoid- able inductance of the leads and connections on the board, which cause resonance at low frequencies for large value capacitors. The Analog PGM supply requires special filtering to attenu- ate high frequencies. High frequencies will increase the jit- ter of the PGM. We recommend a low pass filter formed by a 18-22 Ω resistor and two capacitors in parallel. One of the capacitors should be 22 µF and the other 0.01 µF. (This will implement a single pole low pass filter with 3 dB freq. around 360 - 400 Hz.). The maximum current on this sup- ply is 5 mA. Figure 1. Power Supply Filtering D P 83 86 1 18 Ω − 22 Ω VDD = 3 .3 V 0.01 µF Ty pic a l su pply by pas sing Low pas s filter fo r 22 µF PG M _ A VDD PG M _ AG N D 0.1 µF IO _ VDD IO _ G N D (N ear p ins of th e devic e) BG _ A VDD AG N D BG _ R EF 9 .31 k Ω 0.01 µF P G M _ AV D D only 0.01 µF CO RE _ VDD 0.1 µF 0.01 µF VDD = 1.8 V CO RE _ VSS |
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