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DP83861 Datasheet(PDF) 17 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
Part # DP83861
Description  Gig PHYTER 10/100/1000 Ethernet Physical Layer
PDF  88 Pages
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Manufacturer  NSC [National Semiconductor (TI)]
Direct Link  http://www.national.com
Logo NSC - National Semiconductor (TI)

DP83861 Datasheet(HTML) 17 Page - National Semiconductor (TI)

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3.0 Design and Layout Guide
This guide will provide information to assist in the design
and layout of the DP83861 Gigabit Ethernet Transceiver.
This guide will cover the following areas:
— Power Supply Filtering
— Twisted Pair Interface
— MAC Interface
—Clocks
— LED/Strapping Configuration
— Unused Pins/ Reserved Pins
— Hardware Reset
— Temperature Considerations
— List of Pins and Pin Connection Guide
3.1 Power Supply Filtering
It is recommended that the PCB have at least one solid
ground plane, one solid 3.3 V plane, and one solid 1.8 V
plane, with no breaks in any of these planes. The inter-
plane capacitance between the supply and ground planes
should be maximized by minimizing the distance between
these planes. Filling unused signal planes with copper and
connecting them to the proper power plane will also
increase the interplane capacitance. The inter-plane
capacitance acts like a short at high frequencies to reduce
supply plane impedance. Not all designs will be able to
incorporate the recommended suggestions because of
board cost constraints. Working designs have been done
using only 4 layers. National has a reference design built
using the EN Gig PHYTER and our GigMAC. This refer-
ence design is a PCI NIC card, using only 4 layers and
having component placement on only one side of the board
to reduce cost. The schematic, layout and gerber files for
this reference design are available upon request.
The 3.3 V & the 1.8 V supply pins come in pairs with their
corresponding ground pins (i.e. a 3.3 V supply-ground pair
is formed by pin 2 [RA_AVDD] and pin 3 [RA_AGND]).
These paired pins are physically adjacent to each other.
The matching pins should be bypassed with low imped-
ance surface mount capacitors of value 0.1
µF connected
directly into the power planes with vias as close as possible
to the pins. This will reduce the inductance in series with
the bypass capacitor. Any increase in inductance will lower
the capacitor’s self resonant frequency which will degrade
the high frequency performance of the capacitor. It’s also
recommended that 0.01
µF capacitors are connected in
parallel with the 0.1
µF capacitors, or at least "dispersed",
replacing some of the 0.1
µF capacitors. The lower value
capacitance will increase the frequency range of effective-
ness of the bypassing scheme. This is due to the unavoid-
able inductance of the leads and connections on the board,
which cause resonance at low frequencies for large value
capacitors.
The Analog PGM supply requires special filtering to attenu-
ate high frequencies. High frequencies will increase the jit-
ter of the PGM. We recommend a low pass filter formed by
a 18-22
Ω resistor and two capacitors in parallel. One of
the capacitors should be 22
µF and the other 0.01 µF. (This
will implement a single pole low pass filter with 3 dB freq.
around 360 - 400 Hz.). The maximum current on this sup-
ply is 5 mA.
Figure 1. Power Supply Filtering
D P 83 86 1
18
Ω − 22 Ω
VDD = 3 .3 V
0.01
µF
Ty pic a l su pply by pas sing
Low pas s filter fo r
22
µF
PG M _ A VDD
PG M _ AG N D
0.1
µF
IO _ VDD
IO _ G N D
(N ear p ins of th e devic e)
BG _ A VDD
AG N D
BG _ R EF
9 .31 k
Ω
0.01
µF
P G M _ AV D D only
0.01
µF
CO RE _ VDD
0.1
µF
0.01
µF
VDD = 1.8 V
CO RE _ VSS



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