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DP8422V Datasheet(PDF) 58 Page - National Semiconductor (TI) |
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DP8422V Datasheet(HTML) 58 Page - National Semiconductor (TI) |
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58 / 60 page ![]() 140 Functional Differences between the DP8420V21V22V DP84T22 and the DP84202122 1 Extending the Column Address Strobe (CAS) after AREQ Transitions High The DP8420V21V22V DP84T22 allows CAS to be as- serted for an indefinite period of time beyond AREQ (or AREQB DP8422V DP84T22 only Scrubbing refreshes are not affected) being negated by continuing to assert the appropriate ECAS inputs This feature is allowed as long as the ECAS0 input was negated during program- ming The DP84202122 does not allow this feature 2 Dual Accessing The DP8420V21V22V DP84T22 asserts RAS either one or two clock periods after GRANTB has been assert- ed or negated depending upon how the R0 bit was pro- grammed during the mode load operation The DP84202122 will always start RAS one clock period after GRANTB is asserted or negated The above state- ments assume that RAS precharge has been completed by the time GRANTB is asserted or negated 3 Refresh Request Output (RFRQ) The DP8420V21V22V DP84T22 allows RFRQ (refresh request) to be output on the WE output pin given that ECAS0 was negated during programming or the control- ler was programmed to function in the address pipelining (memory interleaving) mode The DP84202122 only al- lows RFRQ to be output during the address pipelining mode 4 Clearing the Refresh Request Clock Counter The DP8420V21V22V DP84T22 allows the internal re- fresh request clock counter to be cleared by negating DISRFSH and asserting RFSH for at least 500 ns The DP84202122 clears the internal refresh request clock counter if DISRFSH remains low for at least 500 ns Once the internal refresh request clock counter is cleared the user is guaranteed that an internally generated RFRQ will not be generated for at least 13 ms–15 ms (depending upon how programming bits C0 1 2 3 were pro- grammed) 150 DP8420V21V22V DP84T22 User Hints 1 All inputs to the DP8420V21V22V DP84T22 should be tied high low or the output of some other device Note One signal is active high COLINC (EXTNDRF) should be tied low to disable 2 Each ground on the DP8420V21V22V DP84T22 must be decoupled to the closest on-chip supply (VCC) with 01 mF ceramic capacitor This is necessary because these grounds are kept separate inside the DP8420V 21V22V DP84T22 The decoupling capacitors should be placed as close as possible with short leads to the ground and supply pins of the DP8420V21V22V DP84T22 3 The output called ‘‘CAP’’ should have a 01 mF capacitor to ground 4 The DP8420V21V22V DP84T22 has 20X series damping resistors built into the output drivers of RAS CAS address and WE RFRQ Space should be provided for external damping resistors on the printed circuit board (or wire-wrap board) because they may be needed The value of these damping resistors (if needed) will vary de- pending upon the output the capacitance of the load and the characteristics of the trace as well as the routing of the trace The value of the damping resistor also may vary between the wire-wrap board and the printed circuit board To determine the value of the series damping re- sistor it is recommended to use an oscilloscope and look at the furthest DRAM from the DP8420V21V22V DP84T22 The undershoot of RAS CAS WE and the ad- dresses should be kept to less than 05V below ground by varying the value of the damping resistor The damp- ing resistors should be placed as close as possible with short leads to the driver outputs of the DP8420V21V 22V DP84T22 5 The circuit board must have a good VCC and ground plane connection If the board is wire-wrapped the VCC and ground pins of the DP8420V21V22V DP84T22 the DRAM associated logic and buffer circuitry must be soldered to the VCC and ground planes 6 The traces from the DP8420V21V22V DP84T22 to the DRAM should be as short as possible 7 ECAS0 should be held low during programming if the user wishes that the DP8420V21V22V DP84T22 be com- patible with a DP84202122 design 8 Parameter Changes due to Loading All AC parameters are specified with the equivalent load capacitances including traces of 64 DRAMs organized as 4 banks of 18 DRAMs each Maximums are based on worst-case conditions If an output load changes then the AC timing parameters associated with that particular output must be changed For example if we changed our output load to C e 250 pF loads on RAS0 – 3 and CAS0–3 C e 760 pF loads on Q0 – 9 and WE we would have to modify some parameters (not all calcu- lated here) $308a clock to CAS asserted (tRAH e 15 ns tASC e 0 ns) A ratio can be used to figure out the timing change per change in capacitance for a particular parameter by using the specifications and capacitances from heavy and light load timing Ratio e $308a wHeavy Load b $308a wLight Load CH(CAS) b CL(CAS) e 79 ns b 72 ns 125 pF b 50 pF e 7ns 75 pF $308a (actual) e (capacitance difference c ratio) a $308a (specified) e (250 pF b 125 pF) 7ns 75 pF a 79 ns e 117 ns a 79 ns e 907 ns 250 pF load 9 It is required that the user perform a hardware reset to the DP8420V21V22V DP84T22 before programming and using the chip A hardware reset consists of assert- ing both ML and DISRFSH for a minimum of 16 positive edges of CLK see Section 31 58 |
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