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TFP401APZP Datasheet(PDF) 26 Page - Texas Instruments |
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TFP401APZP Datasheet(HTML) 26 Page - Texas Instruments |
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26 / 32 page ![]() 26 TFP401, TFP401A SLDS120G – MARCH 2000 – REVISED MAY 2016 www.ti.com Product Folder Links: TFP401 TFP401A Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated TI PowerPAD 100-TQFP Package (continued) (1) Specified with 2-oz. (0.071 mm thick) Cu PCB plating (2) Airflow is at 0 LFM (0 m/s) (no airflow). (3) Measured at ambient temperature, TA = 70°C Table 5. TI 100-TQFP (14 mm × 14 mm × 1 mm) / 0.5-mm Lead Pitch PARAMETER WITHOUT PowerPAD™ Package PowerPAD™ Package, NOT CONNECTED TO PCB THERMAL PLANE PowerPAD™ Package, CONNECTED TO PCB THERMAL PLANE(1) Theta-JA(1)(2) 45°C/W 27.3°C/W 17.3°C/W Theta-JC(1)(2) 3.11°C/W 0.12°C/W 0.12°C/W Maximum power dissipation(1)(2)(3) 1.6 W 2.7 W 4.3 W |
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