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LMV7219

SNOS458I – APRIL 2000 – REVISED JUNE 2016

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Copyright © 2000–2016, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Pin Configuration and Functions ......................... 3

6

Specifications......................................................... 4

6.1

Absolute Maximum Ratings ...................................... 4

6.2

ESD Ratings.............................................................. 4

6.3

Recommended Operating Conditions ....................... 4

6.4

Thermal Information ................................................. 4

6.5

Electrical Characteristics 2.7 V ................................ 5

6.6

Electrical Characteristics 5 V ................................... 6

6.7

Typical Performance Characteristics ........................ 8

7

Detailed Description ............................................ 11

7.1

Overview ................................................................. 11

7.2

Functional Block Diagram ....................................... 11

7.3

Feature Description................................................. 11

7.4

Device Functional Modes........................................ 11

8

Application and Implementation ........................ 12

8.1

Application Information............................................ 12

8.2

Typical Application ................................................. 12

9

Power Supply Recommendations ...................... 16

10

Layout................................................................... 16

10.1

Layout Guidelines ................................................. 16

10.2

Layout Example .................................................... 17

11

Device and Documentation Support ................. 18

11.1

Documentation Support ........................................ 18

11.2

Receiving Notification of Documentation Updates 18

11.3

Community Resources.......................................... 18

11.4

Trademarks ........................................................... 18

11.5

Electrostatic Discharge Caution ............................ 18

12

Mechanical, Packaging, and Orderable

Information ........................................................... 18

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision H (April 2016) to Revision I

Page

•

Added Supports 105°C PCB Temperature to Features List................................................................................................... 1

•

Changed Operating Temperature to Ambient Temperature .................................................................................................. 4

•

Added Junction Temperature of 125 °C ................................................................................................................................. 4

•

Added PCB Temperature of 105 °C ...................................................................................................................................... 4

•

Changes from Revision G (January 2015) to Revision H

Page

•

Changed "Infrared or Convection (20 sec)" from 235 °C ....................................................................................................... 4

•

Added thermal data for SOT23 and SC70 packages ............................................................................................................ 4

Changes from Revision F (April 2013) to Revision G

Page

•

Added, updated, or renamed the following sections: Device Information Table, Pin Configurations and Functions;

Specifications; Application and Implementation; Power Supply Recommendations; Layout; Device and

Documentation Support; Mechanical, Packaging, and Ordering Information ........................................................................ 1

•

Changed from "transient response" to "eliminate possible output chatter" in Circuit Layout and Bypassing ..................... 16

Changes from Revision E (March 2013) to Revision F

Page

•

Changed layout of National Data Sheet to TI format ............................................................................................................. 1