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TPS2221 Datasheet(PDF) 17 Page - Texas Instruments |
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TPS2221 Datasheet(HTML) 17 Page - Texas Instruments |
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17 / 23 page ![]() TPS2228 TPS2221 SLVS419A – MAY 2002 REVISED SEPTEMBER 2002 www.ti.com 17 SHUTDOWN MODE In the shutdown mode, each of the VCC and VPP/VCORE outputs is forced to a high-impedance state (Hi-Z). In this mode, the chip quiescent current is reduced to conserve battery power. POWER SUPPLY CONSIDERATIONS The TPS2228/2221 power interface switch has multiple pins for each of its power inputs and for the switched VCC outputs. The two 1.8VIN pins must be connected together externally. It is recommended that all input and output power pins be parallel connected for optimum operation. To increase the noise immunity of the TPS2228/2221 power interface switch, the power supply inputs should have a minimum of 1 µF electrolytic or tantalum bypass capacitor connected in parallel with a 0.047 µF to 0.1 µF ceramic capacitor. It is strongly recommended that the switched outputs be bypassed with a 0.1 µF or larger ceramic capacitor. Doing so improves the immunity of the TPS2228/2221 power interface switch to electrostatic discharge (ESD). Care should be taken to minimize the inductance of PCB traces between the TPS2228/2221 power interface switch and the load. RESET To ensure that cards are in a known state after power brownouts or system initialization, the PC cards should be reset at the same time via the host, by applying low impedance paths from VCC and VPP/VCORE terminals to ground. A low-impedance output state allows discharging of residual voltage remaining on PC card filter capacitance, permitting the system (host and PC cards) to be powered up concurrently. The active low RESET input will program all outputs to 0 V. The TPS2228 power interface switch remains in the low-impedance output state until the signal is deasserted and new data is received. For the TPS2228, the input serial data cannot be latched during reset mode. CALCULATING JUNCTION TEMPERATURE The switch resistance, rDS(on), is dependent on the junction temperature, TJ, of the die. The junction temperature is dependent on both rDS(on) and the current through the switch. To calculate TJ, first find rDS(on) from Figures 10 through 14 using an initial temperature estimate about 50 °C above ambient. Then calculate the power dissipation for each switch, using the formula: P D + r DS(on) I2 Next, sum the power dissipation and calculate the junction temperature: T J + S P D RqJA ) TA Where RθJA is the inverse of the derating factor in the dissipation rating table. Compare the calculated junction temperature with the initial temperature estimate. If the temperatures are not within a few degrees of each other, recalculate using the calculated temperature as the initial estimate. LOGIC INPUTS AND OUTPUTS For the TPS2228, the serial interface consists of DATA, CLOCK, and LATCH signals. The data is clocked in on the positive leading edge of the clock (see Figure 2). The 11-bit (D0–D10) serial data word is loaded during the positive edge of the latch signal. The latch signal should occur before the next positive leading edge of the clock. The serial interface of the TPS2228 power interface switch is designed to be compatible with serial-interface PCMCIA controllers and current PCMCIA and Japan Electronic Industry Development Association (JEIDA) standards. For the TPS2221, the parallel interface consists of four bits (D3:D0). These four bits must be driven continuously to select the desired voltage outputs based on the input bit pattern. During power up, these inputs can be connected to an external pulldown resistor to ensure that the outputs are at zero volts, especially if the device driving these inputs is in a high impedance state while initializing. An overcurrent output (OC) is provided to indicate an overcurrent or over-temperature condition in any of the VCC and VPP/VCORE outputs as previously discussed. ESD PROTECTION All TPS2228/2221 power interface switch inputs and outputs incorporate ESD-protection circuitry designed to withstand a 2-kV human-body-model discharge as defined in MIL-STD-883C, Method 3015. The VCC and VPP/ VCORE outputs can be exposed to potentially higher discharges from the external environment through the PC card connector. Bypassing the outputs with 0.1- µF capacitors protects the devices from discharges up to 10 kV. |
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