BM20 datasheet(33/46 Pages) MICROCHIP

Part #	BM20

Description	Bluetooth짰 4.1 Stereo Audio Module

PDF	46 Pages

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Manufacturer	MICROCHIP [Microchip Technology]

Direct Link	http://www.microchip.com

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33 / 46 page

Stereo Module

 2015 Microchip Technology Inc.

Page 33

Preliminary Edition

7.2 REFLOW PROFILE

FIGURE 7-5: REFLOW PROFILE

SolderingRecommendations

Stereo module was assembled using standard lead‐free reflow profile IPC/JEDEC J‐STD‐020. The

module can be soldered to the main PCB using standard leaded and lead‐free solder reflow

profiles. To avoid damaging of the module, the recommendations are listed as follows:

•

Refer to Microchip Technology Application Note AN233 Solder Reflow

Recommendation (DS00233) for the soldering reflow recommendations

•

Do not exceed peak temperature (TP) of 250 degree C

Slope: 1~2℃/sec max.

(217℃ to peak)

Ramp down rate :

Max. 3℃/sec.

Preheat: 150~200℃

25℃

217℃

peak: 260 +5/-0℃

60 ~ 180 sec.

60 ~150sec

20~40 sec.

Time (sec)

BM20 Datasheet(PDF) 33 Page - Microchip Technology