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BM20 Datasheet(PDF) 34 Page - Microchip Technology |
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BM20 Datasheet(HTML) 34 Page - Microchip Technology |
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34 / 46 page  Stereo Module 2015 Microchip Technology Inc. Page 34 Preliminary Edition • Refer to the solder paste data sheet for specific reflow profile recommendations • Use no‐clean flux solder paste • Do not wash as moisture can be trapped under the shield • Use only one flow. If the PCB requires multiple flows, apply the module on the final flow. 8.0 PACKAGING AND STORAGE INFORMATION The module is packaged into trays (see following page) of sixty three (63) modules in a 7 x 9 format. These trays are then sealed into bags. Ten sealed bags are then placed in a box of 630 pieces with a dimension of 36 * 16 * 9.5 cm 3. The shelf life of each module in a sealed bag is 12 months at <40°C and <90% relative humidity. After a bag is opened, devices that will be subjected to reflow solder or other high temperature processes must be mounted within 168 hours (7 days) at factory conditions of <30°C and <60% relative humidity. |
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