Electronic Components Datasheet Search
  English  ▼

X  

AD9121 Datasheet(PDF) 9 Page - Analog Devices

Part # AD9121
Description  TxDAC Digital-to-Analog Converter
PDF  61 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

AD9121 Datasheet(HTML) 9 Page - Analog Devices

Back Button AD9121 Datasheet HTML 5Page - Analog Devices AD9121 Datasheet HTML 6Page - Analog Devices AD9121 Datasheet HTML 7Page - Analog Devices AD9121 Datasheet HTML 8Page - Analog Devices AD9121 Datasheet HTML 9Page - Analog Devices AD9121 Datasheet HTML 10Page - Analog Devices AD9121 Datasheet HTML 11Page - Analog Devices AD9121 Datasheet HTML 12Page - Analog Devices AD9121 Datasheet HTML 13Page - Analog Devices Next Button
Zoom Inzoom in Zoom Outzoom out
 9 / 61 page
background image
AD9121
Data Sheet
Rev. B | Page 8 of 60
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
Rating
AVDD33 to AVSS, EPAD, CVSS, DVSS
−0.3 V to +3.6 V
IOVDD to AVSS, EPAD, CVSS, DVSS
−0.3 V to +3.6 V
DVDD18, CVDD18 to AVSS, EPAD,
CVSS, DVSS
−0.3 V to +2.1 V
AVSS to EPAD, CVSS, DVSS
−0.3 V to +0.3 V
EPAD to AVSS, CVSS, DVSS
−0.3 V to +0.3 V
CVSS to AVSS, EPAD, DVSS
−0.3 V to +0.3 V
DVSS to AVSS, EPAD, CVSS
−0.3 V to +0.3 V
FSADJ, REFIO, IOUT1P, IOUT1N,
IOUT2P, IOUT2N to AVSS
−0.3 V to AVDD33 + 0.3 V
D[15:0]P, D[15:0]N, FRAMEP, FRAMEN,
DCIP, DCIN to EPAD, DVSS
−0.3 V to DVDD18 + 0.3 V
DACCLKP, DACCLKN, REFCLKP,
REFCLKN to CVSS
−0.3 V to CVDD18 + 0.3 V
RESET, IRQ, CS, SCLK, SDIO, SDO
to EPAD, DVSS
−0.3 V to IOVDD + 0.3 V
Junction Temperature
125°C
Storage Temperature Range
−65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
The exposed pad (EPAD) of the 72-lead LFCSP must be
soldered to the ground plane (AVSS). The EPAD provides an
electrical, thermal, and mechanical connection to the board.
Typical θJA, θJB, and θJC values are specified for a 4-layer board in
still air. Airflow increases heat dissipation, effectively reducing
θJA and θJB.
Table 7. Thermal Resistance
Package
θJA
θJB
θJC
Unit
Conditions
72-LeadLFCSP
20.7
10.9
1.1
°C/W
EPAD soldered
to ground plane
ESD CAUTION



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61


Datasheet Download

Go To PDF Page


Link URL



Does ALLDATASHEET help your business so far?  [ DONATE ] 

About Alldatasheet   |   Advertisement   |   Contact us   |   Privacy Policy   |   Link to Datasheet    |   Link Exchange   |   Manufacturer List
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com