Document Number: 002-08441 Rev.*A

Page 32 of 36

MB39C604

14. Recommended Mounting Condition [JEDEC Level3] Lead Free

14.1 Recommended Reflow Condition

Table 8. Recommended Reflow Condition

Items

Contents

Method

IR(Infrared Reflow) / Convection

Times

3 times in succession

Floor life

Before unpacking

Please use within 2 years after production.

From unpacking to reflow

Within 7 days

In case over period of floor life(*1)

Baking with 125°C+/-3°C for 24hrs+2hrs/-0hrs is required. Then please

use within 7 days. (Please remember baking is up to 2 times)

Floor life

condition

Between 5°C and 30°C and also below 60%RH required. (It is preferred lower humidity in the required temp range.)

*1: Concerning the Tape & Reel product, please transfer product to heatproof tray and so on when you perform baking.

Also please prevent lead deforming and ESD damage during baking process.

14.2 Reflow Profile

Figure 18. Reflow Profile

260°C Max. (J-STD-020D)

3°C/s Max.

: Preheat & Soak

150 to 200°C, 60 to 120s

: Peak Temperature

260°C Down, within 30s

: Liquidous Temperature

217°C, 60 to 150s

6°C/s Max.

Time 25°C to Peak

8min Max.

Temperature on the top of the package body is measured.