HTU20D(F) RH/T SENSOR IC

Digital Relative Humidity sensor with Temperature output

9/2015

Page 7

USER GUIDE HTU20D(F)

APPLICATION INFORMATION

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Soldering instructions: Lead free reflow soldering recommended process

For soldering HTU20D(F) sensor standard reflow soldering ovens may be used.

HTU20D(F) sensor as a humidity sensitive component (as classified by IPC/JEDEC J-STD-020 or equivalent

documented procedure with peak temperature at 260°C during up to 30 seconds for Pb-free assembly in

IR/convection reflow ovens) must be handled in a manner consistent with IPC/JEDEC J-STD-033 or an equivalent

documented procedure. IPC-1601 provides humidity control, handling and packing of PCBs.

The H T U 2 0 D ( F ) s ensor is qualified to withstand one lead free reflow soldering recommended process profile

below according to JEDEC standard.

Mount parts within 24 hours after printing solder paste to avoid potential dry up.

For manual soldering, contact time must be limited to 5 seconds at up to 350°C.

For the design of the HTU20D(F) sensor footprint, it is recommended to use dimensions according to figure below.

Recommended footprint for HTU20D(F) sensors. Values in mm.