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TS8388BVFS Datasheet(PDF) 45 Page - ATMEL Corporation |
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TS8388BVFS Datasheet(HTML) 45 Page - ATMEL Corporation |
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45 / 57 page ![]() 45 TS8388B 2144C–BDC–04/03 Nominal CQFP68 Thermal Characteristics Although the power dissipation is low for this performance, the use of a heat sink is mandatory. The user will find some advice on this topics below. Thermal Resistance from Junction to Ambient: RTHJA The following table lists the converter thermal performance parameters, with or without heatsink. For the following measurements, a 50 x 50 x 16 mm heatsink has been used (see Figure 51 on page 46). Note: 1. Heatsink is glued to backside of package or screwed and pressed with thermal grease. Figure 50. Thermal Resistance from Junction to Ambient: Rthja Table 10. Thermal Resitance Air Flow (m/s) ja Thermal Resistance ( °C/W) CQFP68 on Board Estimated – Without Heatsink Targeted – With Heatsink(1) 050 10 0.5 40 8.9 135 7.9 1.5 32 7.3 230 6.8 2.5 28 6.5 326 6.2 424 5.8 523.5 5.6 Air flow (m/s) 0 0 10 20 30 40 50 60 12 3 4 5 Without heatsink With heatsink |
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