PALCE29MA16 datasheet(25/25 Pages) AMD

25 / 25 page

AMD

2-373

PALCE29MA16H-25

TYPICAL THERMAL CHARACTERISTICS

Measured at 25

°C ambient. These parameters are not tested.

Parameter

Symbol

Parameter Description

SKINNYDIP

PLCC

Unit

θjc

Thermal impedance, junction to case

°C/W

θja

Thermal impedance, junction to ambient

°C/W

θjma

Thermal impedance, junction to ambient with air flow

200 lfpm air

°C/W

400 lfpm air

°C/W

600 lfpm air

°C/W

800 lfpm air

°C/W

Typ

Plastic

θjc Considerations

The data listed for plastic

θjc are for reference only and are not recommended for use in calculating junction temperatures. The

heat-flow paths in plastic-encapsulated devices are complex, making the

θjc measurement relative to a specific location on the

package surface. Tests indicate this measurement reference point is directly below the die-attach area on the bottom center of the

package. Furthermore,

θjc tests on packages are performed in a constant-temperature bath, keeping the package surface at a

constant temperature. Therefore, the measurements can only be used in a similar environment.

PALCE29MA16 Datasheet(PDF) 25 Page - Advanced Micro Devices