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AD9869BCPZ Datasheet(PDF) 32 Page - Analog Devices |
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AD9869BCPZ Datasheet(HTML) 32 Page - Analog Devices |
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32 / 37 page ![]() AD9869 Rev. A | Page 31 of 36 For a Tx burst, the falling edge of TXEN is used to generate an internal delayed signal for powering down the Tx circuitry. Upon receipt of this signal, power-down of the Tx circuitry occurs within 100 ns. The user-programmable delay for the Tx path power-down is meant to match the pipeline delay of the last Tx burst sample such that power-down of the TxDAC and IAMP does not impact its transmission. A 5-bit field in Register 0x03 sets the delay from 0 to 31 TXCLK clock cycles, with the default being 31 (0.62 μs with fTXCLK = 50 MSPS). The digital interpolation filter is automatically flushed with midscale samples prior to power-down if the clock signal into the TXCLK pin is present for 33 additional clock cycles after TXEN returns low. For an Rx burst, the rising edge of TXEN is used to generate an internal signal (with no delay) that powers up the Tx circuitry within 0.5 μs. The Rx path power-on/power-off can be controlled by either TXEN or RXEN by setting Bit 2 of Register 0x03. In the default setting, the falling edge of TXEN powers up the Rx circuitry within 2 μs, while the rising edge of TXEN powers down the Rx circuitry within 0.5 μs. If RXEN is selected as the control signal, its rising edge powers up the Rx circuitry, and the falling edge powers it down. To disable the fast power-down of the Tx circuitry and/or Rx circuitry, set Bit 1 and/or Bit 0 to 0. POWER REDUCTION OPTIONS The power consumption of the AD9869 can be significantly reduced from its default setting by optimizing the power consumption vs. performance of the various functional blocks in the Tx signal path and Rx signal path. On the Tx path, minimum power consumption is realized when the TxDAC output is used directly and its standing current is reduced to as low as 1 mA. Although a slight degradation in THD performance results at reduced standing currents, it often remains adequate for most applications because the op amp driver typically limits the overall linearity performance of the Tx path. The load resistors used at the TxDAC outputs (IOUTP+ and IOUTP−) can be increased to generate an adequate differential voltage that can be further amplified via a power efficient op amp- based driver solution. Figure 33 shows how the supply current for the TxDAC is reduced from 55 mA to 14 mA as the standing current is reduced from 12.5 mA to 1.25 mA. Further Tx power savings can be achieved by bypassing or reducing the interpola- tion factor of the digital filter as shown in Figure 34. ISTANDING (mA) 01 23 456 78 9 10 11 12 13 55 10 15 20 25 30 35 40 45 50 Figure 33. Reduction in TxDAC Supply Current vs. Standing Current INPUT DATA RATE (MSPS) 20 30 40 50 60 70 80 55 60 65 15 20 25 30 35 40 45 50 2× INTERPOLATION 4× INTERPOLATION 1× (HALF-DUPLEX ONLY) Figure 34. Digital Supply Current Consumption vs. Input Data Rate (DVDD = DRVDD = 3.3 V and fOUT = fDATA/10) Power consumption on the Rx path can be achieved by reducing the bias levels of the various amplifiers contained within the RxPGA and ADC. As previously noted, the RxPGA consists of two CPGA amplifiers and one SPGA amplifier. The bias levels of each of these amplifiers, along with the ADC, can be controlled via Register 0x13 as shown in Table 24. The default setting for Register 0x13 is 0x00. Table 24. SPI Register for RxPGA and ADC Biasing Address (Hex) Bit Description 0x07 4 ADC low power. 0x13 7:5 CPGA bias adjust. 4:3 SPGA bias adjust. 2:0 ADC power bias adjust. |
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