ADF9010 datasheet(25/29 Pages) AD

25 / 29 page

ADF9010

Rev. 0 | Page 24 of 28

LO AND Tx OUTPUT MATCHING

The LO and Tx output stages are each connected to the collectors

of an NPN differential pair driven by buffered outputs from the

VCO or mixer outputs, respectively.

The recommended matching for each of these circuits consists

of a 7.5 nH shunt inductor to VDD, a 100 pF series capacitor, and

in the case of the Tx output a 50:100 balun to combine the Tx

outputs. The Anaren BD0810J50100A00 is ideally suited to this

task.

PCB DESIGN GUIDELINES

The lands on the chip scale package (CP-48-1) are rectangular.

The printed circuit board pad for these should be 0.1 mm

longer than the package land length and 0.05 mm wider than

the package land width. The land should be centered on the

pad. This ensures that the solder joint size is maximized. The

bottom of the chip scale package has a central thermal pad.

The thermal pad on the printed circuit board should be at least

as large as this exposed pad. On the printed circuit board, there

should be a clearance of at least 0.25 mm between the thermal

pad and the inner edges of the pad pattern. This ensures that

shorting is avoided.

Thermal vias can be used on the printed circuit board thermal

pad to improve thermal performance of the package. If vias are

used, they should be incorporated in the thermal pad at a 1.2 mm

pitch grid. The via diameter should be between 0.3 mm and

0.33 mm, and the via barrel should be plated with 1 oz. copper

to plug the via.

The user should connect the printed circuit board thermal pad

to AGND.

ADF9010 Datasheet(PDF) 25 Page - Analog Devices