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EP7209 Datasheet(PDF) 29 Page - Cirrus Logic

Part # EP7209
Description  Ultra-Low-Power Audio Decoder System-on-Chip
PDF  128 Pages
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Manufacturer  CIRRUS [Cirrus Logic]
Direct Link  http://www.cirrus.com
Logo CIRRUS - Cirrus Logic

EP7209 Datasheet(HTML) 29 Page - Cirrus Logic

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EP7209
DS453PP2
29
Table 12 summarizes the five external interrupt
sources and the effect they have on the processor
interrupts.
3.6
EP7209 Boot ROM
The 128 bytes of on-chip Boot ROM contain a in-
struction sequence that initializes the device and
then configures UART1 to receive 2048 bytes of
serial data that will then be placed in the on-chip
SRAM. Once the download is complete, execution
jumps to the start of the on-chip SRAM. This
would allow, for example, code to be downloaded
to program system FLASH during a product’s
manufacturing process. See Appendix A: Boot
Code for details of the ROM Boot Code with com-
ments to describe the stages of execution.
Selection of the Boot ROM option is determined by
the state of the nMEDCHG pin during a power on
reset. If nMEDCHG is high while nPOR is active,
then the EP7209 will boot from an external memo-
ry device connected to CS[0] (normal boot mode).
If nMEDCHG is low, then the boot will be from the
on-chip ROM. Note that in both cases, following
the de-assertion of power on reset, the EP7209 will
be in the Standby State and requires a low-to-high
transition on the external WAKEUP pin in order to
actually start the boot sequence.
The effect of booting from the on-chip Boot ROM
is to reverse the decoding for all chip selects inter-
nally. Table 13 shows this decoding. The control
signal for the boot option is latched by nPOR,
which means that the remapping of addresses and
bus widths will continue to apply until nPOR is as-
serted again. After booting from the Boot ROM,
the contents of the Boot ROM can be read back
from address 0x00000000 onwards, and in normal
state of operation the Boot ROM contents can be
read back from address range 0x70000000.
Interrupt
Pin
Input State
Operating State
Latency
Idle State
Latency
Standby State Latency
nEXTFIQ
Not deglitched; must be
active for 20
µs to be
detected
Worst case latency
of 20
µsec
Worst case
20
µsec: if only
single cycle
instructions, less
than 1
µsec
Including PLL/osc. settling time, approx.
0.25 sec when FASTWAKE = 0, or
approx. 500 µsec when FASTWAKE = 1,
or = Idle State if in 13 MHz mode with
CLKENSL set
nEINT1–2
Not deglitched
Worst case latency
of 20
µsec
As above
As above
EINT3
Not deglitched
Worst case latency
of 20
µsec
As above
As above
nMEDCHG
Deglitched by 16 kHz
clock; must be active
for at least 125
µs to be
detected
Worst case latency
of 141
µsec
Worst case
80
µsec: if only
single cycle
instructions,
125
µsec
As above (note difference if in 13 MHz
mode with CLKENSL set)
Table 12. External Interrupt Source Latencies
Address Range
Chip Select
0000.0000–0FFF.FFFF
CS[7]
(Internal only)
1000.0000–1FFF.FFFF
CS[6]
(Internal only)
2000.0000–2FFF.FFFF
nCS[5]
3000.0000–3FFF.FFFF
nCS[4]
4000.0000–4FFF.FFFF
nCS[3]
5000.0000–5FFF.FFFF
nCS[2]
6000.0000–6FFF.FFFF
nCS[1]
7000.0000–7FFF.FFFF
nCS[0]
Table 13. Chip Select Address Ranges After Boot From
On-Chip Boot ROM



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