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MP3429GL Datasheet(PDF) 3 Page - Monolithic Power Systems |
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MP3429GL Datasheet(HTML) 3 Page - Monolithic Power Systems |
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3 / 22 page ![]() MP3429 – 21A, HIGH-EFFICIENCY, FULLY INTEGRATED, SYNC, BOOST CONVERTER MP3429 Rev. 1.0 www.MonolithicPower.com 3 6/8/2017 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2017 MPS. All Rights Reserved. ABSOLUTE MAXIMUM RATINGS (1) SW ................................ -0.3V (-3.5V for <10ns) to +18V (22V for <10ns) VIN, EN, MODE, VOUT ............... -0.3V to +18V BST .................................... -0.3V to VSW + 4.5V All other pins............................... -0.3V to +4.5V Continuous power dissipation (TA = +25°C) (2) ................................................................ 4W (5) Junction temperature ............................... 150°C Lead temperature .................................... 260°C Storage temperature................ -65°C to +150°C Recommended Operating Conditions (3) Start-up input voltage (VST) ............. 2.7V to 13V Operation input voltage (VIN).......... 0.8V to 13V Startup input voltage with VDD bias (VST2) ......... ....................................................... 0.9V to 13V Maximum external VDD bias voltage ..... 3.6V (4) Boost output voltage (VOUT) ............VIN to 16V Operating junction temp. (TJ). .. -40°C to +125°C Thermal Resistance ΘJA ΘJC QFN-13 (3mmx4mm) EV3429-L-00A (5) .................. 31........ 4 .... °C/W JESD51-7 (6) ......................... 48....... 11 ... °C/W NOTES: 1) Exceeding these ratings may damage the device. 2) The maximum allowable power dissipation is a function of the maximum junction temperature TJ (MAX), the junction-to- ambient thermal resistance θ JA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD (MAX) = (TJ (MAX)-TA)/θJA. Exceeding the maximum allowable power dissipation produces an excessive die temperature, causing the regulator to go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 3) The device is not guaranteed to function outside of its operating conditions. 4) When the external VDD bias voltage is lower than the normal VDD regulated voltage, the external power prevents current from flowing out of VDD. 5) Measured on EV3429-L-00A, 4-layer 63mmx63mm PCB. 6) Measured on JESD51-7, 4-layer PCB. |
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