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PC7447 Datasheet(PDF) 15 Page - ATMEL Corporation |
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PC7447 Datasheet(HTML) 15 Page - ATMEL Corporation |
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15 / 66 page  15 PC7457/47 [Preliminary] 5345B–HIREL–02/04 Thermal Management Information This section provides thermal management information for the ceramic ball grid array (CBGA) package for air-cooled applications. Proper thermal control design is primarily dependent on the system-level design – the heat sink, airflow, and thermal interface material. To reduce the die-junction temperature, heat sinks may be attached to the package by several methods – spring clip to holes in the printed-circuit board or pack- age, and mounting clip and screw assembly (see Figure 32 on page 55); however, due to the potential large mass of the heat sink, attachment through the printed-circuit board is suggested. If a spring clip is used, the spring force should not exceed 10 pounds. Figure 5. Package Exploded Cross-sectional View with Several Heat Sink Options Printed-Circuit Board Thermal Interface Material Heat Sink Clip Heat Sink CBGA Package |
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