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TPS61372

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SLVSEE7 – JUNE 2018

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Copyright © 2018, Texas Instruments Incorporated

11.3 Thermal Consideration

Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires

special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added

heat sinks and convection surfaces, and the presence of other heat-generating components affect the power

dissipation limits of a given component.

Two basic approaches for enhancing thermal performance are listed below:

• Improving the power dissipation capability of the PCB design

• Improving the thermal coupling of the component to the PCB

As power demand in portable designs is more and more important, designers must figure the best trade-off

between efficiency, power dissipation and solution size. Due to integration and miniaturization, junction

temperature can increase significantly which could lead to bad application behaviors (that is, premature thermal

shutdown or worst case reduce device reliability). Junction-to-ambient thermal resistance is highly application

and board-layout dependent. In applications where high maximum power dissipation exists, special care must be

below 125°C.

12 Device and Documentation Support

12.1 Device Support

12.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT

CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES

OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER

ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

12.2 Trademarks

All trademarks are the property of their respective owners.

12.3 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

12.4 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.