INA1650 datasheet(5/38 Pages) TI1

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INA1650, INA1651

www.ti.com

SBOS818A – DECEMBER 2016 – REVISED SEPTEMBER 2018

Product Folder Links: INA1650 INA1651

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(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Short-circuit to VS / 2 (ground in symmetrical dual supply setups), one amplifier per package.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Voltage

Supply voltage, VS = (V+) – (V–)

Input voltage (Signal inputs, enable, ground)

(V–) – 0.5

(V+) + 0.5

Input differential voltage

(V+) – (V–)

Current

Input current (all pins except power-supply pins)

±10

Output short-circuit(2)

Continuous

Temperature

Operating, TA

–55

125

°C

Junction, TJ

150

Storage, Tstg

–65

150

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 500-V HBM is possible with the necessary precautions.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 250-V CDM is possible with the necessary precautions.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±4000

Charged-device model (CDM), per JEDEC specification JESD22-

C101(2)

±1000

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage (V+ – V–)

4.5 (±2.25)

36 (±18)

Specified temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC(1)

INA1650

INA1651 (Preview)

UNIT

PW (TSSOP)

14 PINS

RθJA

Junction-to-ambient thermal resistance

97.0

99.4

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

22.6

29.9

°C/W

RθJB

Junction-to-board thermal resistance

40.4

42.6

°C/W

ψJT

Junction-to-top characterization parameter

0.9

1.5

°C/W

ψJB

Junction-to-board characterization parameter

39.6

42.0

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

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