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AD5316R Datasheet(PDF) 4 Page - Analog Devices

Part # AD5316R
Description  Quad, 10-Bit nanoDAC Reference, I2C Interface
PDF  24 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

AD5316R Datasheet(HTML) 4 Page - Analog Devices

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AD5316R
Data Sheet
Rev. C | Page 4 of 24
Parameter
Min
Typ
Max
Unit
Test Conditions/Comments1, 2
LOGIC OUTPUTS (SDA)4
Output Low Voltage, VOL
0.4
V
ISINK = 3 mA
Floating State Output Capacitance
4
pF
POWER REQUIREMENTS
VLOGIC
1.8
5.5
V
ILOGIC
3
µA
VDD
2.7
5.5
V
Gain = 1
VREF + 1.5
5.5
V
Gain = 2
IDD
VIH = VDD, VIL = GND, VDD = 2.7 V to 5.5 V
Normal Mode10
0.59
0.7
mA
Internal reference off
1.1
1.3
mA
Internal reference on, at full scale
All Power-Down Modes11
1
4
µA
−40°C to +85°C
6
µA
−40°C to +105°C
1
Temperature range is −40°C to +105°C.
2
The AD5316R and the AD5316 are not pin-to-pin or software compatible.
3
DC specifications are tested with the outputs unloaded, unless otherwise noted. Upper dead band (10 mV) exists only when VREF = VDD with gain = 1 or when VREF/2 = VDD
with gain = 2. Linearity calculated using a reduced code range of 4 to 1020.
4
Guaranteed by design and characterization; not production tested.
5
Channel A and Channel B can have a combined output current of up to 30 mA. Similarly, Channel C and Channel D can have a combined output current of up to
30 mA up to a junction temperature of 110°C.
6
VDD = 5 V. The device includes current limiting that is intended to protect the device during temporary overload conditions. Junction temperature can be exceeded
during current limit. Operation above the specified maximum junction temperature may impair device reliability.
7
When drawing a load current at either rail, the output voltage headroom with respect to that rail is limited by the 25
Ω typical channel resistance of the output
devices. For example, when sinking 1 mA, the minimum output voltage = 25 Ω × 1 mA = 25 mV (see Figure 25).
8
Initial accuracy presolder reflow is ±750 µV; output voltage includes the effects of preconditioning drift. See the Solder Heat Reflow section.
9
Reference is trimmed and tested at two temperatures and is characterized from −40°C to +105°C. Reference temperature coefficient is calculated as per the box method.
See the Terminology section for more information.
10
Interface inactive. All DACs active. DAC outputs unloaded.
11
All DACs powered down.
AC CHARACTERISTICS
VDD = 2.7 V to 5.5 V; VREF = 2.5 V; 1.62 V ≤ VLOGIC ≤ 5.5 V; RL = 2 kΩ; CL = 200 pF; all specifications TMIN to TMAX, unless otherwise noted.
Table 3.
Parameter1, 2
Min
Typ
Max
Unit
Test Conditions/Comments3
Output Voltage Settling Time
5
7
µs
¼ to ¾ scale settling to ±1 LSB
Slew Rate
0.8
V/µs
Digital-to-Analog Glitch Impulse
0.5
nV-sec
1 LSB change around major carry transition
Digital Feedthrough
0.13
nV-sec
Digital Crosstalk
0.1
nV-sec
Analog Crosstalk
0.2
nV-sec
DAC-to-DAC Crosstalk
0.3
nV-sec
Total Harmonic Distortion4
−80
dB
At TA, BW = 20 kHz, VDD = 5 V, fOUT = 1 kHz
Output Noise Spectral Density
300
nV/√Hz
DAC code = midscale, 10 kHz, gain = 2,
internal reference enabled
Output Noise
6
µV p-p
0.1 Hz to 10 Hz
1
Guaranteed by design and characterization; not production tested.
2
See the Terminology section.
3
Temperature range is −40°C to +105°C; typical at 25°C.
4
Digitally generated sine wave at 1 kHz.



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