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AD5316R Datasheet(PDF) 4 Page - Analog Devices |
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AD5316R Datasheet(HTML) 4 Page - Analog Devices |
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4 / 24 page ![]() AD5316R Data Sheet Rev. C | Page 4 of 24 Parameter Min Typ Max Unit Test Conditions/Comments1, 2 LOGIC OUTPUTS (SDA)4 Output Low Voltage, VOL 0.4 V ISINK = 3 mA Floating State Output Capacitance 4 pF POWER REQUIREMENTS VLOGIC 1.8 5.5 V ILOGIC 3 µA VDD 2.7 5.5 V Gain = 1 VREF + 1.5 5.5 V Gain = 2 IDD VIH = VDD, VIL = GND, VDD = 2.7 V to 5.5 V Normal Mode10 0.59 0.7 mA Internal reference off 1.1 1.3 mA Internal reference on, at full scale All Power-Down Modes11 1 4 µA −40°C to +85°C 6 µA −40°C to +105°C 1 Temperature range is −40°C to +105°C. 2 The AD5316R and the AD5316 are not pin-to-pin or software compatible. 3 DC specifications are tested with the outputs unloaded, unless otherwise noted. Upper dead band (10 mV) exists only when VREF = VDD with gain = 1 or when VREF/2 = VDD with gain = 2. Linearity calculated using a reduced code range of 4 to 1020. 4 Guaranteed by design and characterization; not production tested. 5 Channel A and Channel B can have a combined output current of up to 30 mA. Similarly, Channel C and Channel D can have a combined output current of up to 30 mA up to a junction temperature of 110°C. 6 VDD = 5 V. The device includes current limiting that is intended to protect the device during temporary overload conditions. Junction temperature can be exceeded during current limit. Operation above the specified maximum junction temperature may impair device reliability. 7 When drawing a load current at either rail, the output voltage headroom with respect to that rail is limited by the 25 Ω typical channel resistance of the output devices. For example, when sinking 1 mA, the minimum output voltage = 25 Ω × 1 mA = 25 mV (see Figure 25). 8 Initial accuracy presolder reflow is ±750 µV; output voltage includes the effects of preconditioning drift. See the Solder Heat Reflow section. 9 Reference is trimmed and tested at two temperatures and is characterized from −40°C to +105°C. Reference temperature coefficient is calculated as per the box method. See the Terminology section for more information. 10 Interface inactive. All DACs active. DAC outputs unloaded. 11 All DACs powered down. AC CHARACTERISTICS VDD = 2.7 V to 5.5 V; VREF = 2.5 V; 1.62 V ≤ VLOGIC ≤ 5.5 V; RL = 2 kΩ; CL = 200 pF; all specifications TMIN to TMAX, unless otherwise noted. Table 3. Parameter1, 2 Min Typ Max Unit Test Conditions/Comments3 Output Voltage Settling Time 5 7 µs ¼ to ¾ scale settling to ±1 LSB Slew Rate 0.8 V/µs Digital-to-Analog Glitch Impulse 0.5 nV-sec 1 LSB change around major carry transition Digital Feedthrough 0.13 nV-sec Digital Crosstalk 0.1 nV-sec Analog Crosstalk 0.2 nV-sec DAC-to-DAC Crosstalk 0.3 nV-sec Total Harmonic Distortion4 −80 dB At TA, BW = 20 kHz, VDD = 5 V, fOUT = 1 kHz Output Noise Spectral Density 300 nV/√Hz DAC code = midscale, 10 kHz, gain = 2, internal reference enabled Output Noise 6 µV p-p 0.1 Hz to 10 Hz 1 Guaranteed by design and characterization; not production tested. 2 See the Terminology section. 3 Temperature range is −40°C to +105°C; typical at 25°C. 4 Digitally generated sine wave at 1 kHz. |
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