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AD5316R Datasheet(PDF) 22 Page - Analog Devices |
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AD5316R Datasheet(HTML) 22 Page - Analog Devices |
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22 / 24 page ![]() AD5316R Data Sheet Rev. C | Page 22 of 24 INTERNAL REFERENCE SETUP By default, the internal reference is on at power-up. To reduce the supply current, the on-chip reference can be turned off. Command 0111 is reserved for setting up the internal reference. To turn off the internal reference, set the software programmable bit, DB0, in the input shift register using Command 0111, as shown in Table 16. Table 15 shows how the state of the DB0 bit corresponds to the mode of operation. Table 15. Internal Reference Setup Register Internal Reference Setup Register (Bit DB0) Action 0 Reference on (default) 1 Reference off SOLDER HEAT REFLOW As with all IC reference voltage circuits, the reference value experiences a shift induced by the soldering process. Analog Devices, Inc., performs a reliability test called precondition to mimic the effect of soldering a device to a board. The output voltage specification in Table 2 includes the effect of this reliability test. Figure 46 shows the effect of solder heat reflow (SHR) as measured through the reliability test (precondition). 60 0 10 20 30 40 50 2.498 2.499 2.500 2.501 2.502 VREF (V) POSTSOLDER HEAT REFLOW PRESOLDER HEAT REFLOW Figure 46. SHR Reference Voltage Shift LONG-TERM TEMPERATURE DRIFT Figure 47 shows the change in the VREF (ppm) value after 1000 hours at 25°C ambient temperature. ELAPSED TIME (Hours) 140 120 100 80 60 40 20 0 0 100 200 300 400 500 600 700 800 900 1000 –20 Figure 47. Reference Drift Through to 1000 Hours THERMAL HYSTERESIS Thermal hysteresis is the voltage difference induced on the reference voltage by sweeping the temperature from ambient to cold, then to hot, and then back to ambient. Thermal hysteresis data is shown in Figure 48. It is measured by sweeping the temperature from ambient to −40°C, then to +105°C, and then back to ambient. The VREF delta is then measured between the two ambient measurements (shown in blue in Figure 48). The same temperature sweep and measurements were immediately repeated, and the results are shown in red in Figure 48. 9 8 7 6 5 4 3 2 1 0 50 0 –50 –100 –150 –200 DISTORTION (ppm) FIRST TEMPERATURE SWEEP SUBSEQUENT TEMPERATURE SWEEPS Figure 48. Thermal Hysteresis Table 16. 24-Bit Input Shift Register Contents for Internal Reference Setup Command1 DB23 (MSB) DB22 DB21 DB20 DB19 to DB16 DB15 to DB1 DB0 (LSB) 0 1 1 1 X X 1 or 0 Command bits (C3 to C0) Address bits (don’t care) Don’t care Reference setup register 1 X = don’t care. |
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