AD5316R datasheet(23/24 Pages) AD

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Data Sheet

AD5316R

Rev. C | Page 23 of 24

APPLICATIONS INFORMATION

MICROPROCESSOR INTERFACING

Microprocessor interfacing to the AD5316R is via a serial

bus that uses a standard protocol that is compatible with DSP

processors and microcontrollers. The communications channel

requires a 2-wire interface consisting of a clock signal and a

data signal.

AD5316R TO ADSP-BF531 INTERFACE

The I2C interface of the AD5316R is designed for easy connec-

tion to industry-standard DSPs and microcontrollers. Figure 49

shows the AD5316R connected to the Analog Devices Blackfin®

processor. The Blackfin processor has an integrated I2C port

that can be connected directly to the I2C pins of the AD5316R.

ADSP-BF531

SCL

GPIO1

SDA

GPIO2

LDAC

PF9

RESET

PF8

AD5316R

Figure 49. AD5316R to ADSP-BF531 Interface

LAYOUT GUIDELINES

In any circuit where accuracy is important, careful consider-

ation of the power supply and ground return layout helps to

ensure the rated performance. The PCB on which the AD5316R

is mounted should be designed so that the AD5316R lies on the

analog plane.

The AD5316R should have ample supply bypassing of 10 μF

in parallel with 0.1 μF on each supply, located as close to the

package as possible, ideally right up against the device. The 10 μF

capacitor is the tantalum bead type. The 0.1 μF capacitor should

have low effective series resistance (ESR) and low effective series

inductance (ESI), such as the common ceramic types; these

capacitors provide a low impedance path to ground at high

frequencies to handle transient currents due to internal logic

switching.

In systems where many devices are on one board, it is often

useful to provide some heat sinking capability to allow the

power to dissipate easily.

The AD5316R LFCSP models have an exposed pad beneath the

device. Connect this pad to the GND supply for the part. For

optimum performance, use special considerations to design the

motherboard and to mount the package.

For enhanced thermal, electrical, and board level performance,

solder the exposed pad on the bottom of the LFCSP package

to the corresponding thermal land paddle on the PCB. Design

thermal vias into the PCB land paddle area to further improve

heat dissipation.

The GND plane on the device can be increased (as shown in

Figure 50) to provide a natural heat sinking effect.

AD5316R

GND

PLANE

BOARD

Figure 50. Paddle Connection to Board

GALVANICALLY ISOLATED INTERFACE

In many process control applications, it is necessary to provide

an isolation barrier between the controller and the unit being

controlled to protect and isolate the controlling circuitry from

any hazardous common-mode voltages that may occur.

The Analog Devices iCoupler® products provide voltage isolation

in excess of 2.5 kV. The serial loading structure of the AD5316R

makes the part ideal for isolated interfaces because the number of

interface lines is kept to a minimum. Figure 51 shows a 4-channel

isolated interface to the AD5316R using the ADuM1400. For

more information, visit http://www.analog.com/icouplers.

ENCODE

SERIAL

CLOCK IN

CONTROLLER

ADuM1400

SERIAL

DATA OUT

RESET OUT

LOAD DAC

OUT

DECODE

SCL

SDA

RESET

LDAC

VIA

VOA

ENCODE

DECODE

VIB

VOB

ENCODE

DECODE

VIC

VOC

ENCODE

DECODE

VID

VOD

Figure 51. Isolated Interface

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