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BM83 Datasheet(PDF) 62 Page - Microchip Technology

Part # BM83
Description  BM83 Bluetooth짰 Stereo Audio Module Data Sheet
PDF  74 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

BM83 Datasheet(HTML) 62 Page - Microchip Technology

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10.
Soldering Recommendations
The BM83 module can be soldered to the host board using standard leaded and lead-free solder reflow profiles. The
BM83 module is assembled using a standard lead-free reflow profile, IPC/JEDEC J-STD-020.
To avoid the damage to the module, it is mandatory to follow the recommendations as listed:
• Refer to AN233 Solder Reflow Recommendation Application Note for the soldering reflow recommendations.
• Do not exceed peak temperature (TP) of +260ºC.
• Use no-clean flux solder paste.
• Do not wash the module as moisture can be trapped under the shield.
• Use only one flow. If the PCB requires multiple flows, apply the module on the final flow.
The following figure illustrates the reflow profile of the BM83 module.
Figure 10-1. Reflow Profile
Preheat : +150 to +200°C
+217°C
Slope:
+1 to +2°C/sec max.
(+217°C to peak)
Peak: +260°C (+5/0°C tolerance)
Ramp down rate:
+3°C/sec max.
20 to 40 sec
Time (sec)
60 to 180 sec
60 to 150 sec
+25°C
BM83
Soldering Recommendations
© 2019 Microchip Technology Inc.
Preliminary Datasheet
DS70005402A-page 62



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