K32L3A datasheet(3/162 Pages) NXP

3 / 162 page

Table of Contents

1 Ordering information............................................................. 5

2 Overview............................................................................... 5

2.1 System features.............................................................6

2.1.1

Arm Cortex-M0+ core...................................... 7

2.1.2

Arm Cortex-M4 core........................................ 7

2.1.3

NVIC................................................................ 7

2.1.4

AWIC............................................................... 8

2.1.5

Memory............................................................9

2.1.6

Reset and boot................................................ 10

2.1.7

ROM bootloader.............................................. 12

2.1.8

Clock options................................................... 13

2.1.9

Security............................................................18

2.1.10

Power management........................................ 18

2.1.11

LLWU...............................................................24

2.1.12

Debug controller.............................................. 28

2.1.13

INTMUX...........................................................28

2.1.14

FlexBus............................................................28

2.1.15

Watch dog....................................................... 29

2.1.16

EWM................................................................29

2.1.17

XRDC.............................................................. 30

2.1.18

MU................................................................... 31

2.1.19

SEMA42.......................................................... 31

2.1.20

TRGMUX......................................................... 32

2.2 Peripheral features........................................................ 33

2.2.1

MSMC..............................................................33

2.2.2

CRC.................................................................33

2.2.3

LPDAC.............................................................34

2.2.4

eDMA and DMAMUX.......................................34

2.2.5

EMV SIM......................................................... 36

2.2.6

FlexIO.............................................................. 37

2.2.7

LPADC.............................................................37

2.2.8

LPCMP............................................................ 38

2.2.9

LPI2C...............................................................39

2.2.10

LPIT................................................................. 40

2.2.11

LPSPI.............................................................. 41

2.2.12

LPTMR............................................................ 42

2.2.13

LPUART.......................................................... 42

2.2.14

RTC................................................................. 43

2.2.15

I2S................................................................... 44

2.2.16

uSDHC............................................................ 44

2.2.17

TPM................................................................. 45

2.2.18

TRNG.............................................................. 46

2.2.19

USB................................................................. 46

2.2.20

VREF............................................................... 47

2.2.21

TSTMR............................................................ 47

2.2.22

CAU3............................................................... 48

2.3 Memory map..................................................................48

3 Pinouts.................................................................................. 51

3.1 K32 subfamily pinout..................................................... 51

3.2 Pin properties.................................................................59

3.3 Module signal description Tables.................................. 69

3.3.1

Core modules.................................................. 69

3.3.2

System modules.............................................. 70

3.3.3

Memories and memory interfaces................... 71

3.3.4

Clock modules................................................. 72

3.3.5

Communication interfaces............................... 72

3.3.6

Analog............................................................. 79

3.3.7

Human-machine interfaces (HMI)....................79

3.3.8

Timer modules.................................................80

3.3.9

Security modules............................................. 82

3.4 Pinouts diagram.............................................................82

3.5 Package dimensions......................................................83

4 Electrical characteristics........................................................84

4.1 Terminology and guidelines...........................................84

4.1.1

Definitions........................................................85

4.1.2

Examples.........................................................85

4.1.3

Typical-value conditions.................................. 86

4.1.4

Relationship between ratings and operating

requirements....................................................86

4.1.5

Guidelines for ratings and operating

requirements....................................................87

4.2 Ratings...........................................................................87

4.2.1

Thermal handling ratings................................. 87

4.2.2

Moisture handling ratings................................ 88

4.2.3

ESD handling ratings.......................................88

4.2.4

Voltage and current operating ratings............. 88

4.3 General.......................................................................... 89

4.3.1

AC electrical characteristics............................ 89

4.3.2

Nonswitching electrical specifications............. 90

4.3.3

Switching specifications...................................108

4.3.4

Thermal specifications.....................................111

4.4 Peripheral operating requirements and behaviors.........112

4.4.1

Core modules.................................................. 112

4.4.2

System modules.............................................. 116

4.4.3

Clock modules................................................. 117

4.4.4

Memories and memory interfaces................... 120

4.4.5

Security and integrity modules........................ 126

4.4.6

Analog............................................................. 126

4.4.7

Timers..............................................................137

4.4.8

Communication interfaces............................... 137

4.4.9

DC-DC Converter Recommended Electrical

Characteristics.................................................153

5 Design considerations...........................................................154

5.1 Hardware design considerations................................... 154

5.1.1

Printed circuit board recommendations........... 154

5.1.2

Power delivery system.....................................154

5.1.3

Analog design..................................................155

5.1.4

Digital design................................................... 156

5.1.5

Crystal oscillator.............................................. 159

5.2 Software considerations................................................ 159

K32L3A, Rev. 1, 09/2019

NXP Semiconductors

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