TMP139AIYAHT datasheet(47/58 Pages) TI

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8 Application and Implementation

Note

Information in the following applications sections is not part of the TI component specification, and TI

does not warrant its accuracy or completeness. TI’s customers are responsible for determining

suitability of components for their purposes, as well as validating and testing their design

implementation to confirm system functionality.

8.1 Application Information

The TMP139 is used to measure the temperature of the memory components on a DIMM card. The TMP139

features an I2C and I3C bus, and there can be up to 2 devices on the bus as required by the DDR5 application.

As the TMP139 operates on the I3C bus, the device does not require an external pull up resistor on the SDA or

SCL pin.

8.2 Typical Application

TMP139

DD IO = 1.0V

DD SPD = 1.8V

SDA

SCL

DDIO

DDSPD

VSS

TMP139

SDA

SCL

DDIO

DDSPD

VSS

LSCL

LSDA

SPD Hub

Local Sideband Bus

Figure 8-1. Typical Connections

8.2.1 Design Requirements

The I3C bus does not require an external pullup resistor on the SDA pin as the pullup is embedded in the host

controller. The SCL pin is an input-only pin that is driven by the host controller in push-pull mode, and the pin

must be connected directly. The SA pin can only be connected to the VDDSPD or GND.

8.2.2 Detailed Design Procedure

Place the TMP139 devices in close proximity to the heat source that must be monitored with a proper layout for

good thermal coupling. The placement ensures that the temperature changes are captured within the shortest

possible time interval.

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TMP139

SNIS217 – DECEMBER 2020

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