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ADPD4000 Datasheet(PDF) 8 Page - Analog Devices

Part # ADPD4000
Description  Multimodal Sensor Front End
PDF  82 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

ADPD4000 Datasheet(HTML) 8 Page - Analog Devices

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ADPD4000/ADPD4001
Data Sheet
Rev. A | Page 8 of 82
ABSOLUTE MAXIMUM RATINGS
Table 9.
Parameter
Rating
AVDD to AGND
−0.3 V to +2.2 V
DVDD1, DVDD2 to DGND
−0.3 V to +2.2 V
IOVDD to DGND
−0.3 V to +3.9 V
GPIOx, MOSI, MISO, SCLK, CS, SCL,
SDA to DGND
−0.3 V to +3.9 V
LEDxx to LGND
−0.3 V to +3.6 V
Junction Temperature
150°C
Electrostatic Discharge (ESD)
Human Body Model (HBM)
2500 V
Charged Device Model (CDM)
750 V
Machine Model (MM)
100 V
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Close attention to
PCB thermal design is required.
θJA is the natural convection junction to ambient thermal
resistance measured in a one cubic foot sealed enclosure. θJC is
the junction to case thermal resistance.
Table 10. Thermal Resistance
Package Type
θJA
θJC
Unit
CP-35-21
41.89
0.98
°C/W
CB-33-11
42.15
0.98
°C/W
1
The thermal resistance values are defined as per the JESD51-12 standard.
RECOMMENDED SOLDERING PROFILE
Figure 4 and Table 11 provide details about the recommended
soldering profile.
tP
tL
t25°C TO PEAK
tS
PREHEAT
CRITICAL ZONE
TL TO TP
TIME
RAMP-DOWN
RAMP-UP
TSMIN
TSMAX
TP
TL
Figure 4. Recommended Soldering Profile
Table 11. Recommended Soldering Profile
Profile Feature
Condition (Pb-Free)
Average Ramp Rate (TL to TP)
3°C/sec maximum
Preheat
Minimum Temperature (TSMIN)
150°C
Maximum Temperature (TSMAX)
200°C
Time (TSMIN to TSMAX) (tS)
60 sec to 180 sec
TSMAX to TL Ramp-Up Rate
3°C/sec maximum
Time Maintained Above Liquidus
Temperature
Liquidus Temperature (TL)
217°C
Time (tL)
60 sec to 150 sec
Peak Temperature (TP)
+260 (+0/−5)°C
Time Within 5°C of Actual Peak
Temperature (tP)
<30 sec
Ramp-Down Rate
6°C/sec maximum
Time from 25°C to Peak Temperature
8 minutes maximum
ESD CAUTION



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