ADF7030

Data Sheet

APPLICATIONS INFORMATION

TYPICAL APPLICATION CIRCUIT

Typical application circuits for the ADF7030 are shown in

Figure 39 and Figure 40. All external components required for

operation of the device are shown. The bottom of the LFCSP

package has an exposed pad that must be soldered to ground on

the printed circuit board (PCB).

VBAT1

CREG1

VBAT2

CREG2

LNAIN1

LNAIN2

DNC

CREG3

DNC

VBAT4

VBAT5

MOSI

MISO

SCLK

INT2

MOSI

MISO

SCLK

GPIO

HOST

MICROPROCESSOR

GPIO6

DNC

INT1

GPIO4

ADF7030

1

40

39

38

37

36

35

34

33

32

31

11

12

13

14

15

16

17

18

19

20

2

3

4

5

6

8

9

10

30

29

28

27

26

25

24

23

21

7

220nF

100kΩ

100kΩ

100kΩ

100kΩ

100pF

100nF

100pF

100nF

220nF

220nF

220nF

100nF

100pF

1.2nF

TCXO

26MHz

100pF

100nF

100pF

HARMONIC

FILTER

PA1 MATCH

Rx MATCH

PA2 MATCH

HARMONIC

FILTER

100pF

100nF

RST

CS

CS

Figure 39. Application Circuit with Both PAs and LNA Matched, Without External PA or Tx/Rx Switch

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