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CC2652R Datasheet(PDF) 53 Page - Texas Instruments |
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CC2652R Datasheet(HTML) 53 Page - Texas Instruments |
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53 / 58 page ![]() NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance. PACKAGE OUTLINE 4219044/C 09/2020 www.ti.com VQFN - 1 mm max height PLASTIC QUADFLAT PACK- NO LEAD RGZ0048A A 0.08 C 0.1 C A B 0.05 C B SYMM SYMM PIN 1 INDEX AREA 7.1 6.9 7.1 6.9 1 MAX 0.05 0.00 SEATING PLANE C 5.15±0.1 2X 5.5 2X 5.5 44X 0.5 48X 0.5 0.3 48X 0.30 0.18 PIN1 ID (OPTIONAL) (0.2) TYP 1 12 13 24 25 36 37 48 (0.1) TYP SIDE WALL DETAIL OPTIONAL METAL THICKNESS SEE SIDE WALL DETAIL CHAMFERED LEAD CORNER LEAD OPTION (0.45) TYP SEE LEAD OPTION www.ti.com CC2652R7 SWRS253 – MAY 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 53 Product Folder Links: CC2652R7 |
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